PXAC241702FC Datasheet, PDF (9/10 Pages) Infineon Technologies AG – Thermally-Enhanced High Power RF LDMOS FET 150 W, 28 V, 2300 – 2400 MHz

PXAC241702FC
Package Outline Specifications
Package H-37248-4
2X 4.83±0.51
[.190±0.020]
2X 45° X 2.72
[45° X .107]
(8.89
[.350])
CL
(5.08
[.200])
D1
D2
4X R0.76+-00.3.183
[
R.030
+0.005
-0.015
]
FLANGE 9.78
[.385]
LID 9.40
[.370]
19.43±0.51
CL
[.765±0.020]
G1
G2
SPH 1.57
[.062]
2X 12.70
[.500]
19.81±0.20
[.780±0.008]
4X 3.81
[.150]
1.02
[.040]
0.0381 [.0015] -A-
H-37248-4_po_02_01-09-2013

3.76±0.25
[.148±0.010]
CL
S
20.57
[.810]
Diagram Notes—unless otherwise specified:
D₁i_.ag_Ir_na_tm_erN_pro_et_te_ds_i—_mu_en_nl_se_ioss_nsot_ah_ne_drw_tois_lee_ras_np_ce_ec_sifie_pd_e:_{r ASME Y14.5M-1994.}
2. P¹r^.ima^Inr^ty^erd^pim^ree^tn^ds^imio^enⁿs^sa^iore^nsm^amⁿ.^dA^tl^ote^ler^rn^aaⁿt^ce^ed^sim^pee^rn^Asi^Son^Ms^Ea^Yre¹⁴in^.5ch^Me^-s¹.^994.
3. A²l^.l to^Ple^rrⁱa^mn^ac^re^ys^d±^im0^e.1ⁿ2^si7^on[.^s00^a5^re] u^mn^mle^.s^As ^ls^tep^reⁿc^aif^ti^eed^dio^mth^eeⁿr^sw^ioisⁿe^s.^{are inches.}
4. P³i^.ns:^AD^ll1^t,^oD^le2^ra–^ncd^era^sin^±s⁰; ^.G¹²1⁷, G^[.02⁰–^5]g^.ates; S – source.
5. L⁴e^.ad^Ptⁱhⁿi^sc^:kn^De¹s^,s^D: ²0.^–10^dr+^ai0ⁿ.^,0^G76¹/^,–^G0.²02^–5^gm^atm^e, [^S0.⁽0^fl0^a4ⁿ+^g0^e.⁾0^–03^s/^o–^u0^r.^c0^e0^.1 inch].
6. G⁵o^. ld^Lp^ela^at^din^tg^hit^ch^kiⁿck^en^se^s:s⁰s:^.11⁰.1⁺4⁰±^.00⁷.⁶3^/8^–0m^.0ic²r⁵on^[.0[4⁰5⁴ ±^+.1⁰5⁰³m^/–ic^.0ro⁰i¹n^]c^.h].
6. Gold plating thickness: 1.14 ±0.38 micron [45 ±15 microinch].
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www.infineon.com/rfpower
Data Sheet
9 of 10
Rev. 02.1, 2016-06-22