TLE6244X Datasheet, PDF (42/70 Pages) Infineon Technologies AG – 18 Channel Smart Lowside Switch

TLE 6244X
2. Maximum Ratings
2.1 Definition of Test Conditions
The integrated circuit must not be destroyed if maximum ratings are reached. Every maximum
rating is allowed to reach, as far as no other maximum rating is exceeded.
Unless otherwise indicated all voltages are referred to GND (GND pins 1...8 connected to each
other)
Positive current flows into the pin.
2.2 Test Coverage (TC) in Series Production
In the standard production flow not all parameters can be covered due to technical or economic
reasons. Therefore the following test coverage was defined:
A) Parameter test
B) Go/NoGo test (in the course of release qualification/characterization: parameter test)
C) Guaranteed by design (covered by lab tests, not considered within the standard production
flow)
2.3 Thermal Limits
Operating temperature TLE6244
continuous
additionally only for the power switches
(for 100h accumulated)
-40°C ≤ T_J ≤ 150°C
150°C ≤ T_J ≤ 200°C
Storage temperature
Thermal resistance
2.4 Electrical Limits
-55°C ≤ T_C ≤ 125°C
R_thJC ≤ 2,5 K/W
Limits must absolutely not be exceeded. By exceeding only one limit the integrated circuit might
be destroyed.
Power Supplies U_VDD and U_UBatt
Static (without destruction) *)
-0.3V ≤ U_VDD ≤ 36V
-0.3V ≤ U_UBatt ≤ 37V
Dynamic <10µsec (without destruction)
-0.5V ≤ U_VDD ≤ 36V
-0.5V ≤ U_UBatt ≤ 40V
Dynamic (500 ms, 10 x in lifetime, without destruction) -0.5V ≤ U_UBatt ≤ 40V
*) U_VDD > 5.5V is allowed only in case of error conditions! Not suitable for continuous
operation.
SPI Output
Output voltage
-0.3V ≤ U_SO ≤ 36V
Final Data Sheet
42
V4.2, 2003-08-29