TLE7233EM Datasheet, PDF (31/33 Pages) Infineon Technologies AG – SPI Driver for Enhanced Relay Control

11
Package Outlines
SPI Driver for Enhanced Relay Control
SPIDER - TLE7233EM
Package Outlines
0.35 x 45˚
2x
0.1 C
D
3.9 ±0.11)
0.25 ±0.05 ²⁾
0.65 ^C
0.08 C
Seating Plane
0.2 M C A-B D 24x
0.64 _±0.25
D ^{6 ±0.2}
0.2 M D
A
24
13
Bottom View
1
12
1
12
B
8.65 ±0.1
Index Marking
0.1 C A-B 2x
24
13
6.4 ±0.25
1) Does not include plastic or metal protrusion of 0.15 max. per side
2) Does not include dambar protrusion of 0.13 max.
PG-SSOP-24-4-PO V01
Figure 16 PG-SSOP-24-4 (Plastic Green Shrink Small Outline Package)
Green Product (RoHS compliant)
To meet the world-wide customer requirements for environmentally friendly products and to be compliant with
government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e
Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).
You can find all of our packages, sorts of packing and others in our
Infineon Internet Page “Products”: http://www.infineon.com/products.
Data Sheet
31
Dimensions in mm
Rev. 1.2, 2014-05-09