FOA2322A Datasheet, PDF (31/37 Pages) Infineon Technologies AG – 3.2 Gbi t /s Laser Driver IC for Telecom and Datacom Applications

FOA2322A
Table 7
Bottom:
x / µm
271
396
521
646
771
896
1021
1146
1271
1396
1521
1646
Pad Positions
1-12
Right:
y / µm x / µm
137
1777
137
1777
137
1777
137
1777
137
1777
137
1777
137
1777
137
1777
137
1777
137
–
137
–
137
–
13-21
y / µm
267
391
516
693
818
943
1119
1244
1369
–
–
–
Top:
x / µm
271
396
521
646
771
896
1021
1146
1271
1396
1521
1646
– Die size: 1.92 mm × 1.64 mm (excl. seal ring)
– Chip thickness: 300 µm
– Frame grid: 2.024 mm × 1.75 mm
– Bondpad window: 80 µm × 80 µm
– Bondpad material: Aluminium
– Substrate: V_EE
33-22
y / µm
1498
1498
1498
1498
1498
1498
1498
1498
1498
1498
1498
1498
Pin Description
Left:
x / µm
141
141
141
141
141
141
141
141
141
–
–
–
42-34
y / µm
267
391
516
693
818
943
1119
1244
1369
–
–
–
Preliminary Data Sheet
27
2001-05