FOA2322A Datasheet, PDF (30/37 Pages) Infineon Technologies AG – 3.2 Gbi t /s Laser Driver IC for Telecom and Datacom Applications

3.1
Pad Layout
FOA2322A
Pin Description
33 32 31 30 29 28 27 26 25 24 23 22
LDOFF 34
HWA 35
21 V_EE
20 MX
LF 36
19 MODE
RBRIP 37
18 COSC
START 38
RMRIP 39
17 V_EE
16 MD
CMOD 40
15 CBIAS
RMOD 41
14 MPOUT
V_CCA 42
13 RPOUT
y
S1048 1 2 3 4 5 6 7 8 9 10 11 12
x
ITP11336
Figure 11
The pad center x/y positions are given in Table 7 (related to the chip origin 0/0 excl. Seal
ring):
Preliminary Data Sheet
26
2001-05