TC1766 Datasheet, PDF (26/32 Pages) Infineon Technologies AG – 32-Bit Single-Chip Microcontroller Bare Die Delivery

3.3
Wafer Characteristics
TC1766
Bare Die Delivery
Electrical Parameters
Table 7
Wafer Characteristics
Item
Characteristic
Metallization layers
7
Metallization material
1st metallisation: Cu
2nd metallisation: Cu
3rd metallisation: Cu
4th metallisation: Cu
5th metallisation: Cu
6th metallisation: Cu
7th metallisation (BD-step): AlCu
7th metallisation (BF-step): AlCu, NiP, Pd, Au
Metallization thickness
Met1: 0.29 µm
Met2: 0.32 µm
Met3: 0.33 µm
Met4: 0.32 µm
Met5: 0.55 µm
Met6: 0.55 µm
Met7(BD-step): 1.2 µm
Met7(BF-step): 4.53 µm
Topside passivation
Oxide/Nitride/Imide (subject to change)
0.45 / 0.4 / 5 µm
Backside metallization
none (silicon), must be connected to V_SS
Data Sheet
22
V1.10, 2010-04