TC1766 Datasheet, PDF (20/32 Pages) Infineon Technologies AG – 32-Bit Single-Chip Microcontroller Bare Die Delivery

TC1766
Bare Die Delivery
General Device Information
Table 2
Pad Definitions and Functions (cont’d)
Pad Pad Name In / Position [mm] Function
Num (Symbol) Out _x
y
211 V_DDMF
212 V_SSMF
213 V_FAREF
214 V_FAGND
215 AN35
– 40
– 40
– 40
– 40
I 40
2946
2821
2696
2571
2446
FADC analog power supply (3.3V)
FADC Ground
ADC reference voltage
ADC reference ground
FADC[1] negative analog input 35
216 AN34
I
40
2321 FADC[1] positive analog input 34
217 AN33
I
40
2196 FADC[0] negative analog input 33
218 AN32
I
40
2071 FADC[0] positive analog input 32
219 AN31
I
40
1821 Analog input 31
220 AN30
I
40
1696 Analog input 30
221 AN29
I
40
1571 Analog input 29
222 AN28
I
40
1446 Analog input 28
223 AN7
I
40
1321 Analog input 7
224 AN27
I
40
1196 Analog input 27
225 AN26
I
40
1071 Analog input 26
226 AN25
I
40
946 Analog input 25
227 AN24
I
40
821 Analog input 24
228 AN23
I
40
696 Analog input 23
229 AN22
I
40
571 Analog input 22
230 AN21
I
40
446 Analog input 21
231 AN20
I
40
321 Analog input 20
1) This pad is not bonded in TC1766 package devices
2) Giant pad 1 with the dimension of 162µm x 253.22µm
3) Giant pad 2 with the dimension of 162µm x 253.22µm
4) Giant pad 3 with the dimension of 152µm x 253.22µm
5) Giant pad 4 with the dimension of 152µm x 253.22µm
Note: Although not all pads are bonded in TC1766 package, it is recommended to bond
as many supply pads as possible in system.
Note: All V_SS pads must be externally connected together. V_DD pads of the same type
(e.g. all V_DDP lines) should be externally connected together.
Data Sheet
16
V1.10, 2010-04