ICB1FL02G Datasheet, PDF (21/37 Pages) Infineon Technologies AG – Smart Ballast Control IC for Fluorescent Lamp Ballasts

ICB1FL02G
Electrical Characteristics
HSGD Peak Sink Current
I_HSGDsimax
—
Junction Temperature
T_j
-25
Storage Temperature
T_S
-55
Max possible Power Dissipation P_tot
—
Thermal Resistance (Both Chips) R_thJA
—
Junction-Ambient
400
mA < 100ns
150
°C
150
°C
2
W
PG-DSO-18-1, T_amb = 25°C
60
K/W PG-DSO-18-1
Thermal Resistance (HS Chips) R_thJAHS
—
Junction-Ambient
120
K/W PG-DSO-18-1
Thermal Resistance (LS Chips) R_thJALS
—
Junction-Ambient
120
K/W PG-DSO-18-1
Soldering Temperature
ESD Capability
V_ESD
—
260
°C
wave sold. acc.JESD22A111
2
kV
Human body model¹⁾
1) _{According to EIA/JESD22-A114-B (discharging an 100pF capacitor through an 1.5kΩ series resistor).}
6.2 Operating Range.
Parameter
Symbol
Limit Values
min.
max.
HSVCC Supply Voltage
HSGND Supply Voltage
VCC Supply Voltage
LSCS Voltage Range
PFCVS Voltage Range
PFCCS Voltage Range
PFCZCD Current Range
LVS1, LVS2 Voltage Range
LVS1, LVS2 Current Range
LVS1, LVS2 Current Range
Junction Temperature
Adjustable Preheating Frequency
Range set by RFPH
V_HSVCC
V_HSGND
V_VCC
V_LSCS
V_PFCVS
V_PFCCS
I_PFCZCD
V_LVS1,LVS2
I_LVS1,LVS2
I_LVS1,LVS2
T_j
F_RFPH
V_HSVCCoff
-900
V_VCCoff
-4
0
-4
-4
-0.3
2)
-2.5
-25
F_RFRUN
17.0
900
17.5
5
4
5
4
1)
300
2.5
125
150
Adjustable Run Frequency Range F_RFRUN
20
100
set by RFRUN
Adjustable Preheating Time
t_RTPH
0
Range set by RTPH
1980
Set Resistor for Run Frequency R_FRUN
5
25
Set Resistor for Preheating
R_FRUN
3.3
Frequency (R_FRUN parallel R_FPH) II R_FPH
Set Resistor for Preheating Time R_TPH
0
20
1) _{Limited by maximum of current range at LVS1, LVS2}
2) _{Limited by minimum of voltage range at LVS1, LVS2}
Datasheet Version 1.2
21
Unit Remarks
V
referring to HSGND
V
referring to GND
V
V
V
V
mA
V
IC in Power Down Mode
µA
IC in Power Down Mode
mA
IC in Active Mode
°C
kHz
kHz
ms
kΩ
kΩ
kΩ
February 2006