V23814-K1306-M136 Datasheet, PDF (20/27 Pages) Infineon Technologies AG – PAROLI Tx AC, 1.25 Gbit/s

V23814-K1306-M136
V23815-K1306-M136
Assembly
Assembly
On the next pages are some figures to assist the customer in designing his printed circuit
board (PCB). Figure 10 shows the mechanical dimensions of the PAROLI transmitter
and receiver modules and Figure 11 to Figure 13 give the dimensions of the holes and
solder pads on a customer PCB that are necessary to mount the modules on this PCB.
Keeping the tolerances for the PCB given in Figure 11 to Figure 13 is required to
properly attach the PAROLI transmitter and receiver module to the PCB.
Attachment to the customer PCB should be done with four M2 screws torqued to
0.25 Nm +0.05 Nm (see Figure 10, cross section B-B). The screw length a should be 3
to 4 mm plus the thickness b of the customer PCB.
Special care must be taken to remove residues from the soldering and washing process
which can impact the mechanical function. Avoid the use of aggressive organic solvents
like ketones, ethers, etc. Consult the supplier of the PAROLI modules and the supplier
of the solder paste and flux for recommended cleaning solvents.
The following common cleaning solvents will not affect the module: deionized water,
ethanol, and isopropyl alcohol. Air-drying is recommended to a maximum temperature
of 150°C. Do not use ultrasonics.
During soldering, heat must be applied to the leads only, to ensure that the case
temperature never exceeds 150°C. The module must be mounted with a hot-air or hot-
bar soldering process using a SnPb solder type, e.g. Sn62Pb36Ag2, in accordance with
ISO 9435.
Data Sheet
20
2001-12-01