1ED020I12FA Datasheet, PDF (20/22 Pages) Infineon Technologies AG – Single IGBT Driver IC

EICEDRIVER®
1ED020I12FA
Application Notes
8
Application Notes
8.1
Reference Layout for Thermal Data
The PCB layout shown in figure 12 represents the reference layout used for the thermal characterisation. Pins 11, 12, 19 and
20 (GND1) and pins 1, 2, 9 and 10 (VEE2) require ground plane connections for achiving maximum power dissipation. The
1ED020I12FA is conceived to dissipate most of the heat generated through this pins.
PCB + Top-Layer
PCB + Bottom-Layer
Figure 10: Reference layout for thermal data (Copper thickness 102µm)
8.2
Printed Circuit Board Guidelines
Following factors should be taken into account for an optimum PCB layout.
- Sufficient spacing should be kept between high voltage isolated side and low voltage side circuits.
- The same minimum distance between two adjacent high-side isolated parts of the PCB should be maintained to increase the
effective isolation and reduce parasitic coupling.
- In order to ensure low supply ripple and clean switching signals, bypass capacitor trace lengths should be kept as short as
possible.
Datasheet
20
Version 2.1, 2009-11-24