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PTFA041501GL_09 Datasheet, PDF (2/11 Pages) Infineon Technologies AG – Thermally-Enhanced High Power RF LDMOS FETs 150 W, 420-500 MHz
Confidential, Limited Internal Distribution
RF Characteristics (cont.)
Two-tone Measurements (tested in Infineon test fixture)
VDD = 28 V, IDQ = 900 mA, POUT = 150 W PEP, ƒ = 470 MHz, tone spacing = 1 MHz
Characteristic
Gain
Drain Efficiency
Intermodulation Distortion
Symbol Min
Gps
20.0
ηD
45.0
IMD
—
PTFA041501GL
PTFA041501HL
Typ
Max
Unit
21.0
—
dB
46.5
—
%
–29
–28
dBc
DC Characteristics
Characteristic
Drain-Source Breakdown Voltage
Drain Leakage Current
On-State Resistance
Operating Gate Voltage
Gate Leakage Current
Conditions
VGS = 0 V, IDS = 10 µA
VDS = 28 V, VGS = 0 V
VGS = 10 V, VDS = 0.1 V
VDS = 28 V, IDQ = 900 mA
VGS = 10 V, VDS = 0 V
Maximum Ratings
Parameter
Drain-Source Voltage
Gate-Source Voltage
Junction Temperature
Total Device Dissipation
Above 25°C derate by
Storage Temperature Range
Thermal Resistance (TCASE = 70°C, 150 W CW, soldered)
Symbol
V(BR)DSS
IDSS
RDS(on)
VGS
IGSS
Min
65
—
—
2
—
Typ
—
—
0.07
2.48
—
Max
—
1.0
—
3
1.0
Unit
V
µA
Ω
V
µA
Symbol
VDSS
VGS
TJ
PD
TSTG
RθJC
Value
65
–0.5 to +12
200
625
3.57
–40 to +150
0.28
Unit
V
V
°C
W
W/°C
°C
°C/W
Ordering Information
Type and Version
PTFA041501GL V1
Package Type
PG-63248-2
PTFA041501HL V1 PG-64248-2
Package Description
Thermally-enhanced slotted flange,
single-ended
Thermally-enhanced slotted flange,
single-ended
Shipping
Tray
Tray
Marking
PTFA041501GL
PTFA041501HL
*See Infineon distributor for future availability.
Data Sheet
2 of 11
Rev. 03, 2009-04-21