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BFN24_07 Datasheet, PDF (2/7 Pages) Infineon Technologies AG – NPN Silicon High-Voltage Transistors
BFN24, BFN26
Thermal Resistance
Parameter
Junction - soldering point1)
Symbol
RthJS
Value
Unit
≤ 210
K/W
Electrical Characteristics at TA = 25°C, unless otherwise specified
Parameter
Symbol
Values
Unit
min. typ. max.
DC Characteristics
Collector-emitter breakdown voltage
IC = 1 mA, IB = 0 , BFN24
IC = 1 mA, IB = 0 , BFN26
V(BR)CEO
250
-
300
-
V
-
-
Collector-base breakdown voltage
IC = 100 µA, IE = 0 , BFN24
IC = 100 µA, IE = 0 , BFN26
V(BR)CBO
250
-
-
300
-
-
Emitter-base breakdown voltage
IE = 100 µA, IC = 0
Collector-base cutoff current
VCB = 200 V, IE = 0 , BFN24
VCB = 250 V, IE = 0 , BFN26
VCB = 200 V, IE = 0 , TA = 150 °C, BFN24
VCB = 250 V, IE = 0 , TA = 150 °C, BFN26
V(BR)EBO 6
I CBO
-
-
-
-
-
-
µA
-
0.1
-
0.1
-
20
-
20
Emitter-base cutoff current
VEB = 5 V, IC = 0
DC current gain2)
IC = 1 mA, VCE = 10 V
IC = 10 mA, VCE = 10 V
IC = 30 mA, VCE = 10 V, BFN24
IC = 30 mA, VCE = 10 V, BFN26
I EBO
hFE
-
- 100 nA
25
-
40
-
40
-
30
-
-
-
-
-
-
Collector-emitter saturation voltage2)
IC = 20 mA, IB = 2 mA, BFN24
IC = 20 mA, IB = 2 mA, BFN26
Base emitter saturation voltage2)
IC = 20 mA, IB = 2 mA
VCEsat
V
-
-
0.4
-
-
0.5
VBEsat
-
-
0.9
1For calculation of RthJA please refer to Application Note Thermal Resistance
2Pulse test: t < 300µs; D < 2%
2
2007-04-20