PTFB090901EFA Datasheet, PDF (12/14 Pages) Infineon Technologies AG – Thermally-Enhanced High Power RF LDMOS FETs

PTFB090901EA
PTFB090901FA
Package Outline Specifications
Package H-36265-2
45° X 2.03
[.080]
FLANGE
9.78
[.385]
3.05
[.120]
CL
2X 7.11
[.280]
D
6. ALL FOUR
CORNERS
2.66±.51
[.105±.020]
S
LID
10.16±.25
[.400±.010]
15.49±.51
[.610±.020]
2X R1.52
[R.060]
4X R0.63
[R.025] MAX
SPH 1.57
[.062]
1.02
[.040]
G
CL
15.23
[.600]
10.16±.25
[.400±.010]
20.31
[.800]
4X R1.52
[R.060]
h-36265-2_po_09-08-2011
3.61±.38
[.142±.015]
6.
Data Sheet
Diagram Notes—unless otherwise specified:
Diagram1.NoIntetesr—pruentldeismseonthsieornwsisaensdpteocleifriaendc: es per ASME Y14.5M-1994.
12.. IPnrteimrparreyt ddiimmeennssiioonnss aarnedmtomle.rAanltecernsapteerdAimSeMnEsioYn1s4.a5rMe -i1n9ch9e4s. .
23.. PArlilmtoaleryradnimceesn±sio0n.1s2a7re[0m.0m05.]Aultnelrensastespdeimciefiendsionthsearwreisien.ches.
34.. APlilntso:leDra–ncderasin±,0S.1–27so[0u.r0c0e5, ]Gun–legsastes.pecified otherwise.
45.. PLienasd: Dth–ickdnraeisns;:G0.–10ga+t0e.;0S51–/–s0o.u0r2c5e [.004 +.002/–.001].
56.. LEexapdostheidckmnestasl: p0l.a1n0e+o0n.0to5p1/a–n0d.0b2o5ttmommo[0f .c0e0r4am+ic0.i0n0s2u/l–a0to.0r.01 inch].
67.. EGxopldospeladtimngettahlicpklanneesso:n1.t1o4p ±an0d.3b8otmtoicmroonf [c4e5ra±m1ic5 imnsicurloaitnocr.h].
7. Gold plating thickness: 1.14 ± 0.38 micron [45 ± 15 microinch].
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Rev. 05.2, 2016-06-09