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BTM7811K Datasheet, PDF (10/19 Pages) Infineon Technologies AG – TrilithIC
BTM7811K
5
Electrical Characteristics
5.1
Absolute Maximum Ratings
Absolute Maximum Ratings1)
-40 °C < Tj < 110 °C; all voltages with respect to ground, positive current flowing into pin (unless otherwise
specified)
Pos. Parameter
Symbol Limit Values Unit Remarks
min. max.
High-Side-Switches (Pins DHVS, IH1,2 and SH1,2)
5.1.1 Supply voltage
5.1.2
Supply voltage for full short circuit
protection
5.1.3 HS-drain current2)
5.1.4 HS-input current
5.1.5 HS-input voltage
Status Output ST
VS
– 0.3 42
VS(SCP) –
28
IS
– 14
3)
IIH
–5
5
VIH
– 10 16
V–
V
A TA = 25°C; tP < 100 ms
mA Pin IH1 and IH2
V Pin IH1 and IH2
5.1.6 Status pull up voltage
VST
5.1.7 Status Output current
IST
Low-Side-Switches (Pins DL1,2, IL1,2 and SL1,2)
– 0.3 5.4
–5
5
V
mA Pin ST1 or ST2
5.1.8 Drain-Source-Clamp voltage
5.1.9 LS-drain current2)
5.1.10
5.1.11
5.1.12 LS-input voltage
Temperatures
VDSL
55
–
IDL
– 21 26
–
42
–
67
VIL
– 20 20
V VIL = 0 V; ID ≤ 1 mA
Tj = 25°C
A TA = 25°C; tP < 100 ms
A TA = 25°C; tP < 10 ms
A TA = 25°C; tP < 1 ms
V Pin IL1 and IL2
5.1.13 Junction temperature
5.1.14 Storage temperature
ESD Protection4)
Tj
– 40 110
°C –
Tstg
– 55 150
°C –
5.1.15
5.1.16
5.1.17
5.1.18
Input LS-Switch
Input HS-Switch
Status HS-Switch
Output LS and HS-Switch
VESD
–
VESD
–
VESD
–
VESD
–
0.5
kV
1
kV
2
kV
4
kV all other pins connected
to Ground
1) Not subject to production test; specified by design
2) Single pulse
3) Internally limited
4) ESD susceptibility HBM according to EIA/JESD22-A114-B (1.5kΩ, 100pF)
Note: Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Note: Integrated protection functions are designed to prevent IC destruction under fault conditions described in the
data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are
not designed for continuous repetitive operation.
Data Sheet
10
Rev. 1.0, 2008-05-15