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BFP780_15 Datasheet, PDF (10/28 Pages) Infineon Technologies AG – 200 mW High Gain RF Driver Amplifier
BFP780
Recommended Operating Conditions
4
Recommended Operating Conditions
This following table shows examples of recommended operating conditions. As long as maximum ratings are
regarded operation outside these conditions is permitted, but increases failure rate and reduces lifetime. For
further information refer to the quality report available on the BFP780 internet page.
Table 4-1 Recommended Operating Conditions
Operating
Mode
Ambient Collector DC
RF Output Efficiency Dissipated Thermal Junction
Tempera- Current Power2) Power3)
4)
Power5) Resistance Tempera-
ture1)
of pcb6)
ture7)
TA
IC
PDC
PRFout
η
[°C]
[mA]
[mW] [mW] (dBm) [%]
Pdiss
RTHSA
TJ
[mW]
[K/W]
[°C]
Compression 55
90
450
200 (23) 45
250
120
110
Final stage 55
90
450
115 (20.5) 25
340
70
110
High TA
85
50
250
75 (19)
30
175
35
110
Maximum TA 105
20
100
45 (16.5) 45
55
35
110
Linear
55
50
250
20 (13)
8
230
120
110
Very Linear 55
90
450
23 (13.5) 5
430
35
110
1) Is the operating case temperature respectively of the heatsink.
2) PDC = VCE* IC with VCE = 5 V.
3) RF power delivered to the load, PRFout = η * PDC.
4) Efficiency of the conversion from DC power to RF power, η = PRFout / PDC (collector efficiency).
5) Pdiss = PDC - PRFout. The RF output power PRFout delivered to the load reduces the power Pdiss to be dissipated by the device.
This means a good output match is recommended.
6) RTHSA is the thermal resistance of the pcb including heat sink, that is between the soldering point S and the ambient A.
Regard the impact of RTHSA on the junction temperature TJ, see below. The thermal design of the pcb, respectively RTHSA,
has to be adjusted to the intended operating mode.
7) TJ = TA + Pdiss * RTHJA. RTHJA = RTHJS + RTHSA.
RTHJA is the thermal resistance between the transistor junction J and the ambient A.
RTHJS is the combined thermal resistance of die and package, which is 95 K/W for the BFP780, see Chapter 5.
Data Sheet
10
Revision 3.0, 2015-07-08