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ICS843N252-45 Datasheet, PDF (8/16 Pages) Integrated Device Technology – Fourth generation FemtoClock
ICS843N252-45 Data Sheet
FEMTOCLOCK® CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER
Termination for 3.3V LVPECL Outputs
The clock layout topology shown below is a typical termination for
LVPECL outputs. The two different layouts mentioned are
recommended only as guidelines.
The differential outputs are low impedance follower outputs that
generate ECL/LVPECL compatible outputs. Therefore, terminating
resistors (DC current path to ground) or current sources must be
used for functionality. These outputs are designed to drive 50Ω
transmission lines. Matched impedance techniques should be used
to maximize operating frequency and minimize signal distortion.
Figures 2A and 2B show two different layouts which are
recommended only as guidelines. Other suitable clock layouts may
exist and it would be recommended that the board designers
simulate to guarantee compatibility across all printed circuit and clock
component process variations.
3.3V
Zo = 50Ω
3.3V
+
LVPECL
Zo = 50Ω
R1
50Ω
RTT =
1
((VOH + VOL) / (VCC – 2)) – 2
* Zo
_
Input
R2
50Ω
VCC - 2V
RTT
Figure 2A. 3.3V LVPECL Output Termination
3.3V
LVPECL
3.3V
R3
R4
125Ω
125Ω
3.3V
Zo = 50Ω
+
Zo = 50Ω
R1
84Ω
_
R2
84Ω
Input
Figure 2B. 3.3V LVPECL Output Termination
Schematic Example
Figure 3 shows an example of ICS843N252-45 application
schematic. In this example, the device is operated at VCC = VCCA =
VCCOA = 3.3V. If the12pF parallel resonant 25MHz crystal is used; the
load capacitance C1 = 5pF and C2 = 5pF are recommended for
frequency accuracy. If the 18pF parallel resonant 25MHz crystal is
used; the load capacitance C1 = 15pF and C2 = 15pF are
recommended. Depending on the parasitics of the printed circuit
board layout, these values might require a slight adjustment to
optimize the frequency accuracy. Crystals with other load
capacitance specifications can be used. This will require adjusting
C1 and C2. For this device, the crystal load capacitors are required
for proper operation.
As with any high speed analog circuitry, the power supply pins are
vulnerable to noise. To achieve optimum jitter performance, power
supply isolation is required. The ICS843N252-45 provides separate
power supplies to isolate from coupling into the internal PLL.
In order to achieve the best possible filtering, it is recommended that
the placement of the filter components be on the device side of the
PCB as close to the power pins as possible. If space is limited, the
0.1uF capacitor in each power pin filter should be placed on the
device side of the PCB and the other components can be placed on
the opposite side.
Power supply filter recommendations are a general guideline to be
used for reducing external noise from coupling into the devices. The
filter performance is designed for wide range of noise frequencies.
This low-pass filter starts to attenuate noise at approximately 10kHz.
If a specific frequency noise component is known, such as switching
power supply frequencies, it is recommended that component values
be adjusted and if required, additional filtering be added. Additionally,
good general design practices for power plane voltage stability
suggests adding bulk capacitances in the local area of all devices.
The schematic example focuses on functional connections and is not
configuration specific. Refer to the pin description and functional
tables in the datasheet to ensure the logic control inputs are properly
set.
ICS843N252GG-45 REVISION A JULY 6, 2011
8
©2011 Integrated Device Technology, Inc.