ZSSC3218 Datasheet, PDF (50/55 Pages) Integrated Device Technology – High-End 18-Bit Sensor Signal Conditioner

ZSSC3218 Datasheet
Table 4.1 Pad Assignments
Name
VDD
VSS
RES
VDDB
Direction
IN
IN
IN
OUT
INN
IN
EOC
MISO
SS
INP
VSSB
MOSI/SDA
SCLK/SCL
ZMDI-test
OUT
OUT
IN
IN
OUT
IN/Out
IN
-
Type
Supply
Supply
Digital
Analog
Analog
Digital
Digital
Digital
Analog
Analog
Digital
Digital
-
Description
IC positive supply voltage for the IC.
Ground reference voltage signal.
IC reset (low active, internal pull-up).
Positive external bridge-sensor supply.
Negative sensor signal (or sensor-ground for absolute voltage-
sources sensors).
End of conversion or interrupt output.
Data output for SPI.
Slave select for SPI.
Positive sensor signal.
Negative external bridge-sensor supply (sensor ground).
Data input for SPI; data in/out for I²C™.
Clock input for I²C™/SPI.
Do not connect to these pads.
Table 4.2 Die Connection and Bond Parameter
Parameter
TYP
MAX
Au Bond, Pull-Force
-
8g
Cu Bond, Pull-Force
Contact Push-Force to Pad
not specified
0.05g/µm
0.1g/µm
Probing Overdrive
-
55µm
Description / Notes
Soft bonding recommended.
Strongly not recommended.
Applied force during wafer sort and/or bond-wire connection.
Up to 4 touch downs at 85°C maximum; cantilever probe.
Generally, it is strongly recommended that bond and connection experiments be conducted in order to determine
a proper assembly setup (golden wire, time, power, bonding force, etc. by means of wire-pull test, ball-shear test,
and others) that does not lead to any IC and/or pad damages. Higher bond pull-forces maybe possible depending
directly on the bond tool and temperature.
© 2016 Integrated Device Technology, Inc.
50
April 20, 2016