ZSSC3218 Datasheet, PDF (1/55 Pages) Integrated Device Technology – High-End 18-Bit Sensor Signal Conditioner

High-End 18-Bit Sensor Signal
Conditioner
ZSSC3218
Datasheet
Brief Description
The ZSSC3218 is a sensor signal conditioner (SSC)
integrated circuit for high-accuracy amplification and
analog-to-digital conversion of a differential or
pseudo-differential input signal. Designed for high-
resolution sensor module applications, the
ZSSC3218 can perform offset, span, and 1^st and 2^nd
order temperature compensation of the measured
signal. Developed for correction of resistive bridge or
absolute voltage sensors, it can also provide a
corrected temperature output measured with an
internal sensor.
The measured and corrected sensor values are
provided at the digital output pins, which can be
configured as I²C™* (≤ 3.4MHz) or SPI (≤ 20MHz).
Digital compensation of signal offset, sensitivity,
temperature, and non-linearity is accomplished via a
26-bit internal digital signal processor (DSP) running
a correction algorithm. Calibration coefficients are
stored on-chip in a highly reliable, non-volatile,
multiple-time programmable (MTP) memory. Pro-
gramming the ZSSC3218 is simple via the serial
interface. The interface is used for the PC-controlled
calibration procedure, which programs the set of
calibration coefficients in memory. The ZSSC3218
provides accelerated signal processing, increased
resolution, and improved noise immunity in order to
support high-speed control, safety, and real-time
sensing applications with the highest requirements
for energy efficiency.
Features
• Flexible, programmable analog front-end design;
up to 18-bit analog-to-digital converter (ADC)
• Fully programmable gain amplifier for optimizing
sensor signals: gain range 6.6 to 216 (linear)
• Internal auto-compensated temperature sensor
• Digital compensation of individual sensor offset;
1^st and 2^nd order digital compensation of sensor
gain as well as 1^st and 2^nd order temperature gain
and offset drift
• Programmable interrupt operation
• High-speed sensing: e.g. 16-bit conditioned
sensor signal measurement rate >500s^-1
• Typical sensor elements can achieve an accu-
racy of better than ±0.10% FSO** at -40 to 85°C
© 2016 Integrated Device Technology, Inc.
Benefits
• Integrated 26-bit calibration math digital signal
processor (DSP)
• Fully corrected signal at digital output
• Layout customized for die-die bonding with
sensor for high-density chip-on-board assembly
• One-pass calibration minimizes calibration costs
• No external trimming, filter, or buffering com-
ponents required
• Highly integrated CMOS design
• Integrated reprogrammable non-volatile memory
• Excellent for low-voltage and low-power battery
applications
• Optimized for operation in calibrated resistive
(e.g., pressure) sensor or calibrated absolute
voltage (e.g., thermopile) sensor modules
Physical Characteristics
• Supply voltage range: 1.68V to 3.6V
• Current consumption: 1.0mA (operating mode)
• Sleep State current: 20nA (typical)
• Temperature resolution: <0.003K/LSB
• Best-in-class energy-efficiency:
with 16-bit resolution: <140pJ/step
with 18-bit resolution: <50pJ/step
• Operation temperature: –40°C to +85°C
• Small die size
• Delivery options: die for wafer bonding
* I²C™ is a trademark of NXP.
** FSO = Full Scale Output.
ZSSC3218 Application Example
VSS
RES
EOC
MISO
VDD
Stacked-Die Sensor Module
VDD
ZSSC3218
VSS
VDDB
INP(+)
SS
RES
VDDB
INN
EOC
MISO
sensor element
INN(-)
VSSB
INP
VSSB
MOSI
SDA
SCLK
SCL
VSS
VDD
Battery
SS
MOSI
SDA
SCLK
SCL
Microcontroller
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April 20, 2016