ICS621 Datasheet, PDF (5/10 Pages) Integrated Device Technology – LOW SKEW 1 TO 4 CLOCK BUFFER

ICS621
LOW SKEW 1 TO 4 CLOCK BUFFER
FAN OUT BUFFER
AC Electrical Characteristics
VDD = 1.2 V ±5%, Ambient Temperature -40 to +85°C or 0 to +70°C, unless stated otherwise
Parameter
Symbol
Conditions
Min. Typ. Max. Units
Input Frequency
0
100 MHz
Output Rise Time
Output Fall Time
Propagation Delay
t_OR
t_OF
Note 1
20% to 80%, Note 3
80% to 20%, Note 3
1.0 1.5 ns
1.0 1.5 ns
2.2
3
5
ns
Output to Output Skew
Note 2 Rising edges at VDD/2
0 ±150 ps
VDD = 1.5 V ±5%, Ambient Temperature -40 to +85°C or 0 to +70°C, unless stated otherwise
Parameter
Symbol
Conditions
Min. Typ. Max. Units
Input Frequency
0
166 MHz
Output Rise Time
Output Fall Time
Propagation Delay
t_OR
t_OF
Note 1
20% to 80%, Note 3
80% to 20%, Note 3
1.0 1.5 ns
1.0 1.5 ns
2.2
3
5
ns
Output to Output Skew
Note 2 Rising edges at VDD/2
0 ±150 ps
VDD = 1.8 V ±5%, Ambient Temperature -40 to +85°C or 0 to +70°C, unless stated otherwise
Parameter
Symbol
Conditions
Min. Typ. Max. Units
Input Frequency
0
200 MHz
Output Rise Time
Output Fall Time
Propagation Delay
t_OR
t_OF
Note 1
20% to 80%, Note 3
80% to 20%, Note 3
1.0 1.5 ns
1.0 1.5 ns
2.2
3
5
ns
Output to Output Skew
Note 2 Rising edges at VDD/2
0 ±150 ps
Notes: 1. With rail to rail input clock
2. Between any 2 outputs with equal loading.
3. Measured with a 15 pF load.
Thermal Characteristics
Parameter
Symbol Conditions
Thermal Resistance Junction to
Ambient
θ_JA Still air
θ_JA 1 m/s air flow
θ_JA 3 m/s air flow
Thermal Resistance Junction to Case θ_JC
Case Temperature
Thermal Resistance Junction to Top
of Case
Ψ_JT Still air
Min.
Typ.
150
140
120
40
20
Max. Units
°C/W
°C/W
°C/W
°C/W
120 °C
°C/W
IDT™ / ICS™ LOW SKEW 1 TO 4 CLOCK BUFFER
5
ICS621
REV B 030907