ICS8S89874I Datasheet, PDF (17/19 Pages) Integrated Device Technology – 1:2 Differential-to-LVPECL Buffer/Divider

ICS8S89874I Data Sheet
1:2 DIFFERENTIAL-TO-LVPECL BUFFER/DIVIDER
Package Outline and Package Dimensions
Package Outline - K Suffix for 16 Lead VFQFN
Index Area
N
Seating Plane
A1
A3 ^L
(N_D-1)x e
(R ef.)
N
Top View
Anvil
Singulation
or
Sawn
Singulation
E 2 _E2
2
D
Chamfer 4x
0.6 x 0.6 max
OPTIONAL
A
0. 08 C
e
(Ref.)
N_D & N_E
Odd
C
D2
2
D2
(Ref.)
N_D& N_E
Even
e (Typ.)
2 _{If ND & NE}
1 ^{are Even}
2
(N_E -1)x e
(Re f.)
b
Thermal
Base
Bottom View w/Type A ID
Bottom View w/Type B ID
4
2
1
CHAMFER
4
N N-1
There are 3 methods of indicating pin 1 corner
4
at the back of the VFQFN package are:
1. Type A: Chamfer on the paddle (near pin 1)
2. Type B: Dummy pad between pin 1 and N.
3. Type C: Mouse bite on the paddle (near pin 1)
Table 8. Package Dimensions
JEDEC Variation: VEED-2/-4
All Dimensions in Millimeters
Symbol Minimum Maximum
N
16
A
0.80
1.00
A1
0
0.05
A3
0.25 Ref.
b
0.18
0.30
N_D & N_E
D&E
4
3.00 Basic
D2 & E2
1.00
1.80
e
0.50 Basic
L
0.30
0.50
Reference Document: JEDEC Publication 95, MO-220
ICS8S89874BKI REVISION A OCTOBER 22, 2010
2
1
DD
4
17
N N-1
AA
4
Bottom View w/Type C ID
2
1
RADIUS
4
N N-1
©2010 Integrated Device Technology, Inc.