83PR226I-01 Datasheet, PDF (17/22 Pages) Integrated Device Technology – Programmable FemtoClock LVPECL Oscillator Replacement

83PR226I-01 Datasheet
Power Considerations
This section provides information on power dissipation and junction temperature for the 83PR226I-01.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the 83PR226I-01 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V_CC = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
• Power (core)_MAX = V_{CC_MAX}  I_{EE_MAX} = 3.465V  172mA = 595.98mW
• Power (outputs)_MAX = 30mW/Loaded Output pair
Total Power__MAX (3.465V, with all outputs switching) = 595.98mW + 30mW = 625.98mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the device.
The maximum recommended junction temperature for HiPerClockS devices is 125°C.
The equation for Tj is as follows: Tj = _JA  Pd_total + T_A
Tj = Junction Temperature
_JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T_A = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance _JA must be used. Assuming no air flow
and a multi-layer board, the appropriate value is 38.05°C/W per Table 7 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.626W  38.05°C/W = 108.8°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type
of board.
Table 7. Thermal Resistance _JA for 10-VFQFN, Forced Convection
_JA vs. Air Flow
Meters per Second
0
Multi-Layer PCB, JEDEC Standard Test Boards
38.05°C/W
©2017 Integrated Device Technology, Inc.
17
April 13, 2017