STAC9202 Datasheet, PDF (132/135 Pages) Integrated Device Technology – 2-CHANNEL HIGH DEFINITION AUDIO CODEC WITH

STAC9202
2-CHANNEL HIGH DEFINITION AUDIO CODEC WITH DUAL DIGITAL MICROPHONE INTERFACES
PC AUDIO
9. SOLDER REFLOW PROFILE
9.1. Standard Reflow Profile Data
Note: These devices can be hand soldered at 360 ^oC for 3 to 5 seconds.
FROM: IPC / JEDEC J-STD-020C “Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface
Mount Devices” (www.jedec.org/download).
Profile Feature
Average Ramp-Up Rate (Ts_max - Tp)
Preheat
Temperature Min (Ts_min)
Temperature Max (Ts_max)
Time (ts_min - ts_max)
Time maintained above
Temperature (T_L)
Time (t_L)
Pb Free Assembly
3 ^oC / second max
150 ^oC
200 ^oC
60 - 180 seconds
217 ^oC
60 - 150 seconds
Peak / Classification Temperature (Tp) ^{See “Package Classification Reflow Temperatures”}
on page 133.
Time within 5 ^oC of actual Peak Temperature (tp) _{20 - 40 seconds}
Ramp-Down rate ₆ ^o_{C / second max}
Time 25 ^oC to Peak Temperature _{8 minutes max}
Note: All temperatures refer to topside of the package, measured on the package body surface.
Figure 5. Solder Reflow Profile
IDT™ 2-CHANNEL HIGH DEFINITION AUDIO CODEC WITH DUAL DIGITAL MICROPHONE INTERFACES 132
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STAC9202
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