ICS844020-45 Datasheet, PDF (10/13 Pages) Integrated Device Technology – FEMTOCLOCK™ CRYSTAL-TO-LVDS/LVCMOS FREQUENCY SYNTHESIZER

ICS844020-45
FEMTOCLOCK™ CRYSTAL-TO-LVDS/LVCMOS FREQUENCY SYNTHESIZER
PRELIMINARY
2.5V LVDS DRIVER TERMINATION
Figure 4 shows a typical termination for LVDS driver in
characteristic impedance of 100Ω differential (50Ω single)
transmission line environment. For buffer with multiple LDVS
driver, it is recommended to terminate the unused outputs.
2.5V
LVDS_Driv er
2.5V
+
R1
100
-
100 Oh₁m_00ΩD_Diff_ie_ffr_ee_ren_nti_ta_ial_lT_Trr_aa_nn_ss_mm_isis_sis_oi_no_Ln_inL_eine
FIGURE 4. TYPICAL LVDS DRIVER TERMINATION
THERMAL RELEASE PATH
The expose metal pad provides heat transfer from the device
to the P.C. board. The expose metal pad is ground pad
connected to ground plane through thermal via. The exposed
pad on the device to the exposed metal pad on the PCB is
SOLDER M ASK
SIGNAL
TRACE
contacted through solder as shown in Figure 5. For further
information, please refer to the Application Note on Surface
Mount Assembly of Amkor’s Thermally /Electrically Enhance
Leadframe Base Package, Amkor Technology.
EXPOSED PAD
SOLDER
SIGNAL
TRACE
GROUND PLANE
THERMAL VIA
Expose Metal Pad
(GROUND PAD)
FIGURE 5. P.C. BOARD FOR EXPOSED PAD THERMAL RELEASE PATH EXAMPLE
IDT^™ / ICS^™ LVDS/LVCMOS FREQUENCY SYNTHESIZER
10
ICS844020-45 REV A JUNE 14, 2006