ZSSC3027 Datasheet, PDF (1/46 Pages) Integrated Device Technology – Low-Power, High-Resolution 16-Bit Sensor Signal Conditioner

Low-Power, High-Resolution
16-Bit Sensor Signal Conditioner
ZSSC3027
Datasheet
Brief Description
The ZSSC3027 is a sensor signal conditioner (SSC)
integrated circuit for high-accuracy amplification and
analog-to-digital conversion of a differential input
signal. Designed for high-resolution altimeter module
applications, the ZSSC3027 can perform offset,
span, and 1^st and 2^nd order temperature compen-
sation of the measured signal. Developed for correc-
tion of resistive bridge sensors, it can also provide a
corrected temperature output measured with an
internal sensor.
The measured and corrected bridge values are
provided at the digital output pins, which can be
configured as I²C™* (≤ 3.4MHz) or SPI (≤ 20MHz).
Digital compensation of signal offset, sensitivity,
temperature, and non-linearity is accomplished via
an 18-bit internal digital signal processor (DSP) run-
ning a correction algorithm. Calibration coefficients
are stored on-chip in a highly reliable, non-volatile,
multiple-time programmable (MTP) memory. Pro-
gramming the ZSSC3027 is simple via the serial
interface. The IC-internal charge pump provides the
MTP programming voltage. The interface is used for
the PC-controlled calibration procedure, which pro-
grams the set of calibration coefficients in memory.
The ZSSC3027 provides accelerated signal process-
ing in order to support high-speed control, safety,
and real-time sensing applications. It complements
IDT’s ZSSC30x6 products.
Features
• Flexible, programmable analog front-end design;
up to 16-bit scalable, charge-balancing two-
segment analog-to-digital converter (ADC)
• Fully programmable gain amplifier accepting
sensors from 14 to 72 (linear factor)
• Internal auto-compensated temperature sensor
• Digital compensation of individual sensor offset;
1^st and 2^nd order digital compensation of sensor
gain as well as of 1^st and 2^nd order temperature
gain and offset drift
• Layout optimized for stacked-die bonding for
high-density chip-on-board assembly
• Typical sensor elements can achieve accuracy of
better than ±0.10% FSO** @ -40 to 85°C
Benefits
• Integrated 18-bit calibration math DSP
• Fully corrected signal at digital output
• One-pass calibration minimizes calibration costs
• No external trimming, filter, or buffering com-
ponents required
• Highly integrated CMOS design
• Excellent for low-voltage and low-power battery
applications
• Optimized for operation in calibrated resistive
sensor modules
Physical Characteristics
• Supply voltage range: 1.7 to 3.6V
• Operating mode current consumption:
930µA (typical)
• Sleep State current: 20nA (typical)
• Temperature resolution: <0.003K/LSB
• Operation temperatures: –40°C to +85°C
• Small die size
• Delivery options: die for wafer bonding
Available Support
• ZSSC3026 Evaluation Kit can be used to
evaluate ZSSC3027 capabilities
• Support Documentation
ZSSC3027 Application Example
* I²C™ is a trademark of NXP.
** FSO = Full Scale Output.
© 2016 Integrated Device Technology, Inc.
1
April 20, 2016