ICS671-03 Datasheet, PDF (4/4 Pages) Integrated Circuit Systems – 3.3 Volt Zero Delay, Low Skew Buffer

PRELIMINARY INFORMATION
ICS671-03
3.3 Volt Zero Delay, Low Skew Buffer
Package Outline and Package Dimensions
(For current dimensional specifications, see JEDEC Publication No. 95.)
INDEX
AREA
1
2
D
E
H
h x 45°
16 pin SOIC narrow
Inches
Symbol Min Max
A 0.0532 0.0688
A1 0.0040 0.0098
B 0.0130 0.0200
C 0.0075 0.0098
D 0.3859 0.3937
E 0.1497 0.1574
e
.050 BSC
H 0.2284 0.2440
h 0.0099 0.0195
L 0.0160 0.0500
Millimeters
Min Max
1.35 1.75
0.10 0.24
0.33 0.51
0.19 0.24
9.80 10.00
3.80 4.00
1.27 BSC
5.80 6.20
0.25 0.50
0.41 1.27
A
A1
C
B
e
L
Ordering Information
Part/Order Number
ICS671M-03I
ICS671M-03IT
Marking
ICS671M-03I
ICS671M-03I
Shipping packaging
tubes
tape and reel
Package
16 pin SOIC
16 pin SOIC
Temperature
-40 to +85 °C
-40 to +85 °C
While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems,
Incorporated (ICS) assumes no responsibility for either its use or for the infringement of any patents or other rights of third
parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in
normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or
other extraordinary environmental requirements are not recommended without additional processing by ICS. ICS reserves the
right to change any circuitry or specifications without notice. ICS does not authorize or warrant any ICS product for use in life
support devices or critical medical instruments.
MDS 671-03 A
4
Revision 072501
Integrated Circuit Systems, Inc. • 525 Race Street • San Jose • CA • 95126 • [phone] tel • www.icst.com