ICS8534-01 Datasheet, PDF (11/17 Pages) Integrated Circuit Systems – LOW SKEW, 1-TO-22 DIFFERENTIAL-TO-3.3V LVPECL FANOUT BUFFER

Integrated
Circuit
Systems, Inc.
ICS8534-01
LOW SKEW, 1-TO-22
DIFFERENTIAL-TO-3.3V LVPECL FANOUT BUFFER
THERMAL RELEASE PATH
The exposed metal pad provides heat transfer from the device
to the P.C. board. The exposed metal pad is ground pad con-
nected to ground plane through thermal via. The exposed pad
on the device to the exposed metal pad on the PCB is con-
tacted through solder as shown in Figure 6. For further informa-
tion, please refer to the Application Note on Surface Mount As-
sembly of Amkor’s Thermally /Electrically Enhance Leadframe
Base Package, Amkor Technology.
SOLDER M ASK
SIGNAL
TRACE
EXPOSED PAD
SOLDER
SIGNAL
TRACE
GROUND PLANE
THERMAL VIA
Expose Metal Pad
(GROUND PAD)
FIGURE 6. P.C. BOARD FOR EXPOSED PAD THERMAL RELEASE PATH EXAMPLE
8534AY-01
www.icst.com/products/hiperclocks.html
11
REV. A NOVEMBER 19, 2004