IC-DC_17 Datasheet, PDF (6/19 Pages) IC-Haus GmbH – 2-CHANNEL BUCK/BOOST DC/DC CONVERTER

iC-DC
2-CHANNEL BUCK/BOOST DC/DC CONVERTER
Rev B1, Page 6/19
ABSOLUTE MAXIMUM RATINGS
Maximum ratings do not constitute permissible operating conditions; functionality is not guaranteed. Exceeding the maximum ratings can
damage the device.
Item Symbol Parameter
No.
Conditions
Min.
Unit
Max.
G001 V()
Voltage at VB
-38.5
42
V
G002 V()
Voltage at VBR, VBL, ENV1, ENV2
-0.3
42
V
G003 V()
Voltage at VHL, VH, VBROK, NAUT,
TOK, TEST
-0.3
8.4
V
G004 V()
Voltage at VH1, VH2
-0.3
6.4
V
G005 V()
Voltage at VCC1, VCC2, V1OK, V2OK,
CFG1, CFG2, POE1, POE2, RREF,
GNDA
-0.3
5.6
V
G006 I(VB)
Current in VB
-50
800
mA
G007 I(VBR) Current in VBR
-50
800
mA
G008 I(VBL)
Current in VBL
-800
50
mA
G009 I(VHL) Current in VHL
-50
800
mA
G010 I()
Current in VH, VH1, VH2, VCC1, VCC2
-500
20
mA
G011 I()
Current in CFG1, CFG2, ENV1, ENV2,
V1OK, V2OK, VBROK, NAUT, TOK,
POE1, POE2, RREF, TEST, GNDA
-20
20
mA
G012 Vd()
ESD Susceptibility at all pins
HBM, 100 pF discharged through 1.5 kΩ
2
kV
G013 Tj
Chip-Temperature
-40
150
°C
G014 Ts
Storage Temperature Range
-40
150
°C
THERMAL DATA
Operating conditions: VB = +4 V to +36 V
Item Symbol Parameter
No.
Conditions
T01 Ta
Operating Ambient Temperature Range
T02 Rthja
Thermal Resistance Chip to Ambient Surface mounted, Thermal-Pad soldered to
QFN24
approx. 2 cm² copper area on the PCB
Unit
Min. Typ. Max.
-40
105 °C
30 40 K/W
All voltages are referenced to ground (pin GND: power ground) unless otherwise stated.
All currents flowing into the device pins are positive; all currents flowing out of the device pins are negative.