IC-DC_17 Datasheet, PDF (4/19 Pages) IC-Haus GmbH – 2-CHANNEL BUCK/BOOST DC/DC CONVERTER

iC-DC
2-CHANNEL BUCK/BOOST DC/DC CONVERTER
PACKAGING INFORMATION
Rev B1, Page 4/19
PIN CONFIGURATION
QFN24-4x4
(topview)
24 23 22 21 20 19
1
18
2
17
3
<P-CODE>
16
4
<A-CODE>
15
5
<D-CODE>
14
6
13
7 8 9 10 11 12
PIN FUNCTIONS
No. Name Function
1 RREF Reference Resistor
2 GNDA Analog Ground
3 CFG1 VCC1 Configuration 3.3/5.0 V or
1.5 V to 5.5 V with ext. R Divider
4 CFG2 VCC2 Configuration2.5/3.3 V or
1.5 V to 5.5 V with ext. R Divider
5 TEST Test Input
6 POE2 Power Output Enable VCC2 Voltage
7 V2OK Error Output VCC2 Voltage
8 VCC2 1.5 V to 5.5 V Lin. Regulator Output 2
9 VH2 Intermediate Voltage 2
for VCC2 Regulator
10 VH1 Intermediate Voltage 1
for VCC1 Regulator
11 VCC1 1.5 V to 5.5 V Lin. Regulator Output 1
12 V1OK Error Output VCC1 Voltage
13 POE1 Power Output Enable VCC1 Voltage
14 VH
Intermediate Voltage
15 VHL Inductor Terminal VH
16 GND Power Ground
17 VBL Inductor Terminal VB
18 VBR Reverse Protected Supply Voltage
19 VB
+4 V to +36 V Supply Voltage
20 ENV1 VCC1 Linear Regulator Activation
21 ENV2 VCC2 Linear Regulator Activation
22 VBROK Error Output Supply Voltage
23 TOK Error Output Overtemperature
24 NAUT Error Output Autarky
BP
Backside Paddle (Thermal Pad)
IC top marking: <P-CODE> = product code, <A-CODE> = assembly code (subject to changes), <D-CODE> = date code (subject to changes);
To improve the heat dissipation connect the backside paddle to an extended copper area connected to GND. Avoid any current flow across the paddle.
The heat distribution can be supported by connecting further PCB layers using thermal vias. If those need to be placed below the paddle, prefer blind vias.
GNDA should also be directly connected to neutral point GND. Ground loops should be avoided.