IC-GF_15 Datasheet, PDF (4/30 Pages) IC-Haus GmbH – TRANSCEIVER

iC-GF
TRANSCEIVER
PACKAGING INFORMATION
Rev F1, Page 4/30
PIN CONFIGURATION QFN24 4 mm x 4 mm
24 23 22 21 20 19
1
18
2
17
3
16
TP
4
15
5
14
6
13
7 8 9 10 11 12
PIN FUNCTIONS
No. Name Function
1 ISET Reference Current for current limitation
of driver outputs
2 INV1 Inverting Input Channel 1
ESPI Enable SPI (pin open)
3 IN1 Input Channel 1
TX
Transmission Input (SPI mode)
4 QCFG1 Configuration Input Channel 1
NCS Chip Select (SPI mode)
PIN FUNCTIONS
No. Name Function
5 QCFG2 Configuration Input Channel 2
SCLK Serial Clock (SPI mode)
6 IN2 Input Channel 2
MOSI Master Output Slave Input (SPI mode)
7 OEN Output Enable Input
8 NOVL Overload Error Output
NDIAG Diagnosis Output (SPI mode)
9 NUVD Undervoltage Error Output
MISO Master Input Slave Output (SPI mode)
10 CFO Feedback Channel Output
RX
Transmission Output (SPI mode)
11 CFP Configuration Input Feedback Channel
12 CFI Feedback Channel Input
13 QP2 High Side Switch Output Channel 2
14 QN2 Low Side Switch Output Channel 2
15 VN
Ground
16 QN1 Low Side Switch Output Channel 1
17 QP1 High Side Switch Output Channel 1
18 VBO Power Supply
19 VBR Power Supply for switching converter
20 VHL Inductor Switching Converter
21 VH
Input Linear Regulators
22 VCC 5 V Sensor Supply
23 VCC3 3.3 V Sensor Supply
24 GND Sensor Ground
The Thermal Pad is to be connected to a Ground Plane (VN) on the PCB.
Only pin 1 marking on top or bottom defines the package orientation (iC-GF label and coding is subject
to change).
Do not short circuit line side ground (pin VN) and sensor side ground (pin GND). Otherwise interferences
introduced at the line side may affect the sensor function.