IC-DI Datasheet, PDF (3/15 Pages) IC-Haus GmbH – DUAL SENSOR INTERFACE

iC-DI
DUAL SENSOR INTERFACE
PACKAGES QFN24 4 mm x 4 mm to JEDEC Standard
Rev C2, Page 3/15
PIN CONFIGURATION QFN24 4 mm x 4 mm
24
23
22
21
20
19
1
18
2
17
3
16
DI
4
15
code...
5
...
14
6
13
7
8
9
10
11
12
PIN FUNCTIONS
No. Name Function
1 ISET Reference Current for current limitation
of driver outputs
2 INV1 Inverting Input Channel 1
3 IN1 Input Channel 1
PIN FUNCTIONS
No. Name Function
4 QCFG1 Configuration Input Channel 1
5 QCFG2 Configuration Input Channel 2
6 IN2 Input Channel 2
7 OEN Output Enable Input
8 NOVL Overload Error Output
9 NUVD Undervoltage Error Output
10 CFO Output Feedback Channel
11 CFP Configuration Input Feedback Channel
12 CFI Input Feedback Channel
13 QP2 Output High Side Switch Channel 2
14 QN2 Output Low Side Switch Channel 2
15 VN
Reference Voltage Low Side Switch
16 QN1 Output Low Side Switch Channel 1
17 QP1 Output High Side Switch Channel 1
18 VBO Reference Voltage High Side Switch
19 VBR Power Supply switching converter and
linear regulators
20 VHL Inductor Switching Converter
21 VH
Input Linear Regulators
22 VCC 5 V Sensor Supply
23 VCC3 3.3 V Sensor Supply
24 GND Ground
Pins GND and VN must not be externally connected, otherwise with reverse bias intolerably high current
may flow!
The Thermal Pad is to be connected to a Ground Plane (VN) on the PCB.
Only pin 1 marking on top or bottom defines the package orientation (iC-DI label and coding is subject
to change).