IC-HB_13 Datasheet, PDF (2/8 Pages) IC-Haus GmbH – TRIPLE 155MHz LASER SWITCH

iC-HB
TRIPLE 155 MHz LASER SWITCH
Rev A4, Page 2/8
DESCRIPTION
Triple Laser Switch iC-HB enables the spike-free
switching of laser diodes with well-defined current
pulses at frequencies ranging from DC to 155 MHz.
The diode current is determined by the voltages at
pins CIx.
The three fast switches are controlled independently
via LVDS/TTL inputs. Input TTL = hi selects TTL type
inputs. The laser diode can thus be turned on and off
or switched between different current levels (LDKx
connected) defined by the voltages at CI1, CI2 and
CIB. Channel B is preferably used for biasing.
For current monitoring purpose IMON sinks a fraction
of the sum of currents into LDKx:
I(IMON) = ^{I(LDK1) + I(LDK2)} + ^I(LDKB)
92
75
Each channel can be operated at 65 mA DC (chan-
nel B: 60 mA) and up to 300 mA (channel B: 275 mA)
pulsed current depending on the frequency, duty cy-
cle and heat dissipation.
The integrated thermal shutdown feature protects the
IC from damage by excessive temperature.
PACKAGING INFORMATION QFN24 to JEDEC
PIN CONFIGURATION QFN24 4 mm x 4 mm
24
23
22
21
20
19
1
18
2
17
3
16
HB
4
15
code...
5
...
14
6
13
7
8
9
10
11
12
PIN FUNCTIONS
No. Name Function
1 AGND2 Analogue ground channel 2
2 LDK2 Laser diode cathode channel 2
3 LDKB Laser diode cathode channel B
4 AGNDB Analogue ground channel B
5 LDK1 Laser diode cathode channel 1
6 AGND1 Analogue ground channel 1
PIN FUNCTIONS
No. Name Function
7 EP1 Positive LVDS/TTL switching input chan-
nel 1
8 EN1 Negative LVDS switching input channel 1
9 SYN1 Sync output channel 1
10 VTTL Sync TTL output supply voltage
11 SYNB Sync output channel B
12 CI1 Current control voltage channel 1
13 ENB Negative LVDS switching input channel
B
14 EPB Positive LVDS/TTL switching input chan-
nel B
15 VDD +5 V supply voltage
16 GND Ground
17 CIB Current control voltage channel B
18 IMON Laser diode current monitor output
19 CI2 Current control voltage channel 2
20 NER Temperature shutdown monitor output
21 TTL TTL inputs selector (EPx)
22 SYN2 Sync output channel 2
23 EN2 Negative LVDS switching input channel 2
24 EP2 Positive LVDS/TTL switching input chan-
nel 2
For improved heat dissipation the thermal pad is to be connected to a ground plane on the PCB.
Only pin 1 marking on top or bottom defines the package orientation ( HB label and coding is subject
to change).