H3055LJ Datasheet, PDF (3/4 Pages) Hi-Sincerity Mocroelectronics – N-Channel Enhancement-Mode MOSFET (20V, 13A)

HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : MOS200606
Issued Date : 2006.03.01
Revised Date : 2006.05.04
Page No. : 3/4
TO-252 Dimension
M
Marking:
A
a1
Pb Free Mark
Pb-Free: " . " ^(Note)
Normal: None ^H
J
F
3055L
1
a5
L
C
G
2
3
a2
H
a1
Date Code
Control Code
Note: Green label is used for pb-free packing
Pin Style: 1.Gate 2.Drain 3.Source
N
Material:
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
3-Lead TO-252 Plastic
Surface Mount Package
HSMC Package Code: J
DIM Min. Max.
A
6.35 6.80
C
4.80 5.50
F
1.30 1.70
G
5.40 6.25
H
2.20 3.00
L
0.40 0.90
M
2.20 2.40
N
0.90 1.50
a1 0.40 0.65
a2
-
*2.30
a5 0.65 1.05
*: Typical, Unit: mm
A
B
C
D
a1
E
J
K
a2
y2
F
y1
M
a1
Marking:
Pb Free Mark
Pb-Free: " . " ^(Note)
Normal: None
H
J
3055L
GI
y1
H
L
a2
y1
N
a1
O
Date Code
Control Code
Note: Green label is used for pb-free packing
Pin Style: 1.Gate 2.Drain 3.Source
Material:
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
y2
3-Lead TO-252 Plastic
Surface Mount Package
HSMC Package Code: J
DIM Min. Max.
A
6.40 6.80
B
-
6.00
C
5.04 5.64
D
-
*4.34
E
0.40 0.80
F
0.50 0.90
G
5.90 6.30
H
2.50 2.90
I
9.20 9.80
J
0.60 1.00
K
-
0.96
L
0.66 0.86
M
2.20 2.40
N
0.70 1.10
O
0.82 1.22
a1 0.40 0.60
a2 2.10 2.50
y1
-
5^o
y2
-
3^o
*: Typical, Unit: mm
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: [phone] Fax: [phone]
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: [phone]~5 Fax: [phone]
H3055LJ
HSMC Product Specification