HDMP-0480 Datasheet, PDF (9/11 Pages) Agilent(Hewlett-Packard) – Octal Cell Port Bypass Circuit without Clock and Data Recovery

Package Information
HDMP-0480 Thermal Characteristics, T_C = 0°C to +85°C, V_CC = 3.15V to 3.45V
Symbol Parameter
Unit
Typ.
Max.
θ_jc
Thermal Resistance, Junction to Case °C/W
10
—
Note: Based on independent testing by Agilent. θ_ja for these devices is 56°C/W for the HDMP-0480.
θ_ja is measured on a standard 3x3” FR4 PCB in a still air environment. To determine the actual
junction temperature in a given application, use the following equation: T_j = T_C + (θ_jc x P_D), where T_C
is the case temperature measured on the top center of the package, and P_D is the power being
dissipated.
Item
Package Material
Lead Finish Material
Lead Finish Thickness
Lead Skew
Lead Coplanarity
(Seating Plane Method)
Details
Plastic
85% Tin, 15% Lead
300 – 800 micro-inches
0.08 mm max.
0.08 mm max.
Pin #1 ID
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
1
48
2
47
3
46
4
45
5
44
6
43
7
42
8
41
9
40
10
39
11
38
12
37
13
36
14
35
15
34
16
33
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
10.00 ± 0.10
13.20 ± 0.25
10.00 ± 0.10
13.20 ± 0.25
Top View
2.00 + 0.10,
- 0.05
2.45 MAX.
0.25 MIN.
All dimensions shown in mm
Seating
Plane
Figure 6. HDMP-0480 Package Drawing.
9
0.22 ± 0.05
0.50
BASIC
0.17 MAX.
0.88
+ 0.15, - 0.10
0.25
Gauge
Plane