HCPL-5120 Datasheet, PDF (7/16 Pages) Agilent(Hewlett-Packard) – 2.0 Amp Output Current IGBT Gate Drive Optocoupler

Package Characteristics
Over recommended operating conditions (T_A = -55 to +125°C) unless otherwise specified.
Parameter
Symbol
Input-Output
I_I-O
Leakage Current
Resistance
R_I-O
(Input-Output)
Capacitance
C_I-O
(Input-Output)
Test Conditions
V_I-O = 1500Vdc
RH = 45%,
t = 5 sec.,
T_A = 25°C
V_I-O = 500 V_DC
Group A
Limits
Subgroups
Units Fig Note
(13)
Min. Typ.* Max.
1
1.0 µA
5, 6
10¹⁰
Ω
6
f = 1 MHz
2.5
pF
6
*All typicals at T_A = 25°C.
Notes:
1. Maximum pulse width = 10 µs, maximum duty cycle = 0.2%. This value is intended to allow for component tolerances for designs with I_O peak minimum
= 2.0 A. See Applications section for additional details on limiting I_OH peak.
2. Maximum pulse width = 50 µs, maximum duty cycle = 0.5%.
3. In this test V_OH is measured with a dc load current. When driving capacitive loads V_OH will approach V_CC as I_OH approaches zero amps.
4. Maximum pulse width = 1 ms, maximum duty cycle = 20%.
5. This is a momentary withstand test, not an operating condition.
6. Device considered a two-terminal device: pins on input side shorted together and pins on output side shorted together.
7. The difference between t_PHL and t_PLH between any two HCPL-5120 parts under the same test condition.
8. Pins 1 and 4 need to be connected to LED common.
9. Common mode transient immunity in the high state is the maximum tolerable dV_CM/dt of the common mode pulse, V_CM, to assure that the output will
remain in the high state (i.e., V_O > 15.0 V).
10. Common mode transient immunity in a low state is the maximum tolerable dV_CM/dt of the common mode pulse, V_CM, to assure that the output will
remain in a low state (i.e., V_O < 1.0 V).
11. This load condition approximates the gate load of a 1200 V/75A IGBT.
12. Pulse Width Distortion (PWD) is defined as |t_PHL-t_PLH| for any given device.
13. Standard parts receive 100% testing at 25°C (Subgroups 1 and 9). SMD and Class H parts receive 100% testing at 25, 125, and -55°C (Subgroups 1 and 9,
2 and 10, 3 and 11, respectively).
14. Parameters are tested as part of device initial characterization and after design and process changes. Parameters are guaranteed to limits specified for
all lots not specifically tested.
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