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HCPL-5120 Datasheet, PDF (4/16 Pages) Agilent(Hewlett-Packard) – 2.0 Amp Output Current IGBT Gate Drive Optocoupler
Absolute Maximum Ratings
Parameter
Symbol
Min.
Max.
Units
Note
Storage Temperature
Operating Temperature
Case Temperature
Junction Temperature
Lead Solder Temperature
TS
-65
+150
°C
TA
-55
+125
°C
TC
+145
°C
TJ
+150
°C
260 for 10s °C
Average Input Current
Peak Transient Input Current
(<1 µs pulse width, 300 pps)
IF AVG
IF PK
25
mA
1
1.0
A
Reverse Input Voltage
“High” Peak Output Current
“Low” Peak Output Current
Supply Voltage
Output Voltage
Emitter Power Dissipation
Output Power Dissipation
Total Power Dissipation
VR
IOH (PEAK)
IOL (PEAK)
(VCC-VEE) 0
VO (PEAK)
0
PE
PO
PT
5
V
2.5
A
2
2.5
A
2
35
V
VCC
V
45
mW
1
250
mW
3
295
mW
4
Notes:
1. No derating required for typical case-to-ambient thermal resistance (θCA=140°C/W). Refer to Figure 35.
2. Maximum pulse width = 10µs, maximum duty cycle = 0.2%. This value is intended to allow for component tolerances for designs with IO peak minimum =
2.0A. See Applications section for additional details on limiting IOH peak.
3. Derate linearly above 102°C free air temperature at a rate of 6mW/°C for typical case-to-ambient thermal resistance (θCA=140°C/W). Refer to Figure 36.
4. Derate linearly above 102°C free air temperature at a rate of 6mW/°C for typical case-to-ambient thermal resistance (θCA=140°C/W). Refer to Figure 35
and 36.
ESD Classification
MIL-STD-883, Method 3015
(▲), Class 1
Recommended Operating Conditions
Parameter
Power Supply Voltage
Input Current (ON)
Input Voltage (OFF)
Operating Temperature
Symbol
Min.
(VCC – VEE) 15
IF (ON)
10
VF (OFF)
-3.0
TA
-55
Max.
30
18
0.8
125
Units
Volts
mA
Volts
°C
4