HMMC-5618 Datasheet, PDF (6/6 Pages) Agilent(Hewlett-Packard) – 6-20 GHz Amplifier

To V_DD Power Supply
Chip Capacitor
(≥68 pF)
Gold Plated Shim
(Optional)
RF_IN
RF_OUT
Figure 8a. Assembly for single drain-bias operation.
Figure 8. HMMC-5618 Assembly Diagrams.
0 143 355 573
920
V_D1
V_D2
530
IN
OUT
530
To V_DD Power Supply
Chip Capacitor
(≥68 pF)
Gold Plated Shim
(Optional)
RF_IN
RF_OUT
Bonding Island
or Small
Chip-Capacitor
To V_G1 Power
Supply
To V_G2 Power
Supply
Figure 8b. Assembly with gate bias connections.
V_G1
V_G2
0
0
0 79
593
920
Figure 9. HMMC-5618 Bonding Pad Positions. (Dimensions are in micrometers.)
This data sheet contains a variety of typical and guaranteed performance data. The
information supplied should not be interpreted as a complete list of circuit specifica-
tions. In this data sheet the term typical refers to the 50th percentile performance. For
additional information contact your local HP sales representative.
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