HMMC-3108 Datasheet, PDF (5/8 Pages) Agilent(Hewlett-Packard) – DC-16 GHz Packaged Divide-by-8

Assembly Notes
Independent of the bias applied
to the package, the backside of
the package should always be
connected to both a good RF
ground plane and a good
thermal heat sinking region on
the PC–board to optimize
performance. For single–ended
output operation the unused RF
output lead should be
terminated into 50W to a contact
point at the V_CC potential or to
RF ground through a dc blocking
capacitor.
A minimum RF and thermal PC
board contact area equal to or
greater than 2.67 x 1.65 mm
(0.105" x 0.065") with eight
0.020" diameter plated–wall
thermal vias is recommended.
MMIC ESD precautions,
handling considerations, die
attach and bonding methods are
critical factors in successful
GaAs MMIC performance and
reliability.
Figure 2. Package & Dimensions
Agilent application note #54,
“GaAs MMIC ESD, Die Attach
and Bonding Guidelines”
provides basic information on
these subjects.
Moisture Sensitivity
Classification: Class 1, per
JESD22-A112-A.
Additional References:
PN #18, “HBT Prescaler
Evaluation Board.”
Notes:
- All dimensions in millimeters.
- Refer to JEDEC Outline MS-012 for
additional tolerances.
Symbol Min
Max
A
1.35
1.75
A1
0.0
.25
B
0.33
0.51
C
0.19
.025
D
4.80
5.00
E
3.80
4.00
e
1.27 BSC
H
5.80
6.20
L
0.40
1.27
a
0°
8°
V_CC
6
V_CC
4
V_CC
2
- Exposed heat slug area on pkg bottom =
2.67 x 1.65
- Exposed heat sink on package bottom must
be soldered to PCB RF ground plane.
150p
IN ₅
IN
7
By
poss
IN
50
Vcc
50
IN
Vcc
÷
Vee
SOIC8 w/Backside GND
8
V_EE
Figure 3. Assembly Diagram (Single-supply, Positive-bias Configuration shown)
5
Vcc
50
50
OUT
OUT
Vpwr
sel
3 ^OUT
OUT
Pin 1