HCPL-2200 Datasheet, PDF (4/11 Pages) Agilent(Hewlett-Packard) – Low Input Current Logic Gate Optocouplers

Maximum Solder Reflow Thermal Profile
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
∆T = 115°C, 0.3°C/SEC
∆T = 100°C, 1.5°C/SEC
1
23
4
5
6
7
8
TIME – MINUTES
∆T = 145°C, 1°C/SEC
9 10 11 12
Note: Use of nonchlorine activated fluxes is highly recommended.
Regulatory Information
The HCPL-2200/2219 have been
approved by the following
organizations:
UL
Recognized under UL 1577,
Component Recognition
Program, File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File CA
88324.
VDE
Approved according to VDE
0884/06.92. (HCPL-2219 Option
060 Only)
Insulation and Safety Related Specifications
Parameter
Symbol Value Units
Conditions
Min. External Air Gap L(IO1) 7.1
(External Clearance)
mm Measured from input terminals to output terminals,
shortest distance through air.
Min. External
L(IO2) 7.4
Tracking Path
(External Creepage)
mm Measured from input terminals to output terminals,
shortest distance path along body.
Minimum Internal
Plastic Gap
(Internal Clearance)
0.08 mm Through insulation distance, conductor to conductor,
usually the direct distance between the photoemitter
and photodetector inside the optocoupler cavity.
Tracking Resistance
CTI
200
V
DIN IEC 112/VDE 0303 Part 1
(Comparative
Tracking Index)
Isolation Group
IIIa
Material Group (DIN VDE 0110, 1/89, Table 1)
Option 300 - surface mount classification is Class A in accordance with CECC 00802.
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