HCPL-1930 Datasheet, PDF (1/12 Pages) Agilent(Hewlett-Packard) – Dual Channel Line Receiver Dual Channel Line Receiver Dual Channel Line Receiver

Dual Channel Line Receiver
Hermetically Sealed
Optocoupler
Technical Data
Features
• Dual Marked with Device
Part Number and DSCC
Standard Microcircuit
Drawing
• Manufactured and Tested on
a MIL-PRF-38534 Certified
Line
• QML-38534, Class H and
Class K
• Hermetically Sealed 16-pin
Dual In-Line Package
• Performance Guaranteed
Over -55°C to +125°C
• High Speed – 10 Mb/s
• Accepts a Broad Range of
Drive Conditions
• Adaptive Line Termination
Included
• Internal Shield Provides
Excellent Common Mode
Rejection
• External Base Lead Allows
"LED Peaking" and LED
Current Adjustment
• 1500 Vdc Withstand Test
Voltage
• High Radiation Immunity
• HCPL-2602 Function
Compatibility
• Reliability Data Available
Applications
• Military and Space
• High Reliability Systems
• Isolated Line Receiver
• Simplex/Multiplex Data
Transmission
• Computer-Peripheral
Interface
• Microprocessor System
Interface
• Harsh Environmental
Environments
• Digital Isolation for A/D,
D/A Conversion
• Current Sensing
• Instrument Input/Output
Isolation
• Ground Loop Elimination
• Pulse Transformer
Replacement
Truth Table
HCPL-1930
HCPL-1931
HCPL-193K
5962-89572
Description
The HCPL-193X devices are dual
channel, hermetically sealed,
high CMR, line receiver optocoup-
lers. The products are capable of
operation and storage over the
full military temperature range
and can be purchased as either a
standard product or with full
MIL-PRF-38534 Class Level H or
K testing, or from the DSCC
Standard Microcircuit Drawing
(SMD) 5962-89572. This is a
sixteen pin DIP which may be
purchased with a variety of lead
bend and plating options. See
selection guide table for details.
Standard Microcircuit Drawing
(SMD) parts are available for each
lead style.
Functional Diagram
The connection of a 0.1 µF bypass capacitor between pins 15 and 10 is recommended.
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to
prevent damage and/or degradation which may be induced by ESD.