HMC5983-DEM Datasheet, PDF (6/28 Pages) Honeywell Accelerometers – 3-Axis Digital Compass IC

HMC5983
*Layout examples are for I²C (dual supply and single supply) modes only.
PCB Pad Definition and Traces
The HMC5983 is a fine pitch LCC package. Refer to previous figure for recommended PCB footprint for proper package
centering. Size the traces between the HMC5983 and the external capacitors (C1 and C2) to handle the 1 ampere peak
current pulses with low voltage drop on the traces.
Stencil Design and Solder Paste
A 4 mil stencil and 100% paste coverage is recommended for the electrical contact pads.
Reflow Assembly
This device is classified as MSL 3 with 260 C peak reflow temperature. A baking process (125 C, 24 hrs) is required if
device is not kept continuously in a dry (< 10% RH) environment before assembly. No special reflow profile is required for
HMC5983, which is compatible with lead eutectic and lead-free solder paste reflow profiles. Honeywell recommends
adherence to solder paste manufacturer’s guidelines. Hand soldering is not recommended. Built-in self test can be used
to verify device functionalities after assembly.
External Capacitors
The two external capacitors should be ceramic type construction with low ESR characteristics. The exact ESR values are
not critical but values less than 200 milli-ohms are recommended. Reservoir capacitor C1 is nominally 4.7 µF in
capacitance, with the set/reset capacitor C2 nominally 0.22 µF in capacitance. Low ESR characteristics may not be in
many small SMT ceramic capacitors (0402), so be prepared to up-size the capacitors to gain Low ESR characteristics.
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