HMC415LP3 Datasheet, PDF (7/8 Pages) Hittite Microwave Corporation – GaAs InGaP HBT MMIC POWER AMPLIFIER, 4.9 - 5.9 GHz

v02.0604
MICROWAVE CORPORATION
HMC415LP3
GaAs InGaP HBT MMIC
POWER AMPLIFIER, 4.9 - 5.9 GHz
8
Evaluation PCB
List of Material
Item
Description
J1 - J2
PC Mount SMA RF Connector
J3
2 mm DC Header
C1 - C3
330 pF Capacitor, 0603 Pkg.
C4
2.2 µF Capacitor, Tantalum
C5
0.5 pF Capacitor, 0603 Pkg.
C6
7.0 pF Capacitor, 0402 Pkg.
L1
3.0 nH Inductor, 0805 Pkg.
U1
HMC415LP3 Amplifier
PCB*
104723 Eval Board
* Circuit Board Material: Rogers 4350
The circuit board used in the final application should use RF
circuit design techniques. Signal lines should have 50 ohm
impedance while the package ground leads and exposed
paddle should be connected directly to the ground plane
similar to that shown. A sufficient number of VIA holes
should be used to connect the top and bottom ground
planes. The evaluation board should be mounted to an
appropriate heat sink. The evaluation circuit board shown is
available from Hittite upon request.
8 - 194
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