HMC620_09 Datasheet, PDF (4/6 Pages) Hittite Microwave Corporation – GaAs MMIC I/Q MIXER 3 - 7 GHz

v01.1007
Harmonics of LO
LO Freq. (GHz)
nLO Spur at RF Port
1
2
3
4
2.5
29
35
48
30
3
26
33
51
39
4
28
32
39
43
5
28
36
45
52
6
36
44
60
41
7
40
36
58
34
8
46
37
55
46
LO = +15 dBm
Values in dBc below input LO level measured at RF Port.
Absolute Maximum Ratings
RF / IF Input
LO Drive
Channel Temperature
Continuous Pdiss (T=85°C)
(derate 14.2 mW/°C above 85°C)
Thermal Resistance (R )
TH
(channel to die bottom)
Storage Temperature
Operating Temperature
+20 dBm
+27 dBm
150 °C
925 mW
70.2 °C/W
-65 to +150 °C
-55 to +85 °C
Outline Drawing
HMC620
GaAs MMIC I/Q MIXER
3 - 7 GHz
MxN Spurious Outputs
nLO
mRF
0
1
2
3
4
0
xx
1
15
28
69
1
15
0
30
39
50
2
69
67
78
60
71
3
95
95
95
73
95
4
95
95
95
95
95
RF = 5.6 GHz @ -10 dBm
LO = 5.5 GHz @ +15 dBm
Data taken without IF 90˚ hybrid
All values in dBc with reference to output power at IF= 100 MHz
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Die Packaging Information ^[1]
Standard
Alternate
WP-3 (Waffle Pack)
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. DIE THICKNESS IS .004”
3. TYPICAL BOND PAD IS .004” SQUARE
4. BACKSIDE METALIZATION: GOLD
5. BOND PAD METALIZATION: GOLD
6. BACKSIDE METAL IS GROUND
7. CONNECTION NOT REQUIRED FOR
UNLABELED BOND PADS.
8. OVERALL DIE SIZE ±.002”
3
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
Order On-line at www.hittite.com
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