HMC454ST89 Datasheet, PDF (14/14 Pages) Hittite Microwave Corporation – InGaP HBT 1/2 WATT HIGH IP3 AMPLIFIER, 0.4 - 2.5 GHz

v02.0404
MICROWAVE CORPORATION
HMC454ST89
InGaP HBT ½ WATT HIGH IP3
AMPLIFIER, 0.4 - 2.5 GHz
Alternate 900 MHz Evaluation PCB
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List of Materials
Item
Description
J1 - J2
PC Mount SMA Connector
J3 - J4
DC Pins
C1
4 pF Capacitor, 0402 Pkg.
C2, C6
10 pF Capacitor, 0402 Pkg.
C3
3.0 pF Capacitor, 0402 Pkg.
C4
100 pF Capacitor, 0402 Pkg
L1
18 nH Inductor, 0402 Pkg.
U1
HMC454ST89
PCB*
107750 Evaluation PCB, 10 mils
* Circuit Board Material: Rogers 4350, Er = 3.48
The circuit board used in this application should use RF
circuit design techniques. Signal lines should have 50
ohm impedance while the package ground leads and
exposed paddle should be connected directly to the
ground plane similar to that shown. A sufficient number
of VIA holes should be used to connect the top and
bottom ground planes. The evaluation board should be
mounted to an appropriate heat sink. The evaluation cir-
cuit board shown is available from Hittite upon request.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
Order Online at www.hittite.com
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