HMC454ST89 Datasheet, PDF (10/14 Pages) Hittite Microwave Corporation – InGaP HBT 1/2 WATT HIGH IP3 AMPLIFIER, 0.4 - 2.5 GHz

v02.0404
MICROWAVE CORPORATION
900 MHz Evaluation PCB
HMC454ST89
InGaP HBT ½ WATT HIGH IP3
AMPLIFIER, 0.4 - 2.5 GHz
8
List of Materials for Evaluation PCB 107755*
Item
J1 - J2
J3 -J4
C1
C2
C3
C4, C6
C5
Description
PC Mount SMA Connector
DC Pins
8 pF Capacitor, 0402 Pkg.
22 pF Capacitor, 0402 Pkg.
2.7 pF Capacitor, 0402 Pkg.
100 pF Capacitor, 0402 Pkg.
2.2 µF Capacitor, Tantalum
The circuit board used in this application should use RF
circuit design techniques. Signal lines should have 50
ohm impedance while the package ground leads and
exposed paddle should be connected directly to the
ground plane similar to that shown. A sufficient number
of VIA holes should be used to connect the top and
bottom ground planes. The evaluation board should be
mounted to an appropriate heat sink. The evaluation cir-
cuit board shown is available from Hittite upon request.
L1, L2
1 nH Inductor, 0402 Pkg.
L3
36 nH Inductor, 0402 Pkg.
R1
5.1 Ohms
U1
HMC454ST89 Linear Amp
PCB**
107753 Evaluation PCB, 10 mils
** Circuit Board Material: Rogers 4350, Er = 3.48
* Reference this number when ordering complete evaluation PCB.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
Order Online at www.hittite.com
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