FH25-21S-0.3SH Datasheet, PDF (8/8 Pages) Hirose Electric – 0.3 mm Contact Pitch, 0.9 mm above the board, Flexible Printed Circuit ZIF Connectors.

BFH25 Series FPC Construction (Recommended)
1. Using Single-sided FPC
Name
Material
Thickness (µm)
Covering film layer
Polyamide 1 mil thick.
25
Cover adhesive
25
1µm to 5µm nickel underplated
Surface treatment
(3)
0.2µm gold plated
Copper foil
Cu
1oz
35
Base adhesive
25
Base film
Polyamide 1 mil thick
25
Reinforcement material adhesive
30
Stiffener
Polyamide 3 mil thick
75
Total
193
2. Using Double-sided FPC
Rear side
Name
Material
Thickness (µm)
Covering film layer
Polyamide 1 mil thick
25
Cover adhesive
25
1µm to 5µm nickel underplated
Surface treatment
(3)
0.2µm gold plated
Through-hole copper
Cu
15
Copper foil
Cu
1/2oz
18
Base adhesive
18
Base film
Polyamide 1 mil thick
25
Base adhesive
18
Copper foil
Cu
1/2oz
18
Cover adhesive
25
Covering layer film
Polyamide 1 mil thick
25
Reinforcement material adhesive
25
Stiffener
Polyamide 1 mil thick
25
Total
197
To prevent release of the lock due to FPC bending, use of the FPC with copper foil on rear side is NOT RECOMMENDED.
3. Precautions
Note: Recommended specification for FPC 0.2 ± 0.03 mm thick.
®
5-23,OSAKI 5-CHOME,SHINAGAWA-KU,TOKYO 141-8587,JAPAN
PHONE: [phone], FAX: [phone]
http://www.hirose.com
http://www.hirose-connectors.com
The contents of this catalog are current as of date of publication. Contents are subject to change without notice for the purpose of improvements.
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