FH25-21S-0.3SH Datasheet, PDF (7/8 Pages) Hirose Electric – 0.3 mm Contact Pitch, 0.9 mm above the board, Flexible Printed Circuit ZIF Connectors.

BRecommended Temperature Profile
qUsing Typical Solder Paste
5 sec. max.
250
240ç
200
200ç
150
ç)
100
150ç
160ç
50
25ç(60sec.)
(30sec.)
60 sec. to 90 sec.
20 sec. to 30 sec.
0
Start
60 Preheating 120
Soldering
Time (Seconds)
HRS test conditions
Solder method :Reflow, IR/hot air
(Nihon Den-netsu Co., Ltd.’s Part Number:
SENSBY NR-2)
Environment
:Room air
Solder composition :Paste, 63%Sn/37%Pb
(Senju Metal Industry, Co., Ltd.’s Part Number:
OZ63-201C-50-9)
Test board
:Glass epoxy 70mm∞80mm∞1.6mm thick
Land dimensions:
0.3mm∞0.65mm,0.3mm∞0.8mm
Metal mask
:0.23∞0.55∞0.1mm thick,
0.23∞0.65∞0.1mm thick
This temperature profile is based on the above conditions.
In individual applications the actual temperature may vary,
depending on solder paste type, volume/thickness and board
size/thickness. Consult your solder paste and equipment
manufacturer for specific recommendations.
qUsing Lead-free Solder Paste
250
200
200ç
MAX 250ç
230ç
150
ç)
100
150ç
50
25ç(60sec.) _{60 sec. to 120 sec.}
(60sec.)
0
Start
60 Preheating 120 Soldering
Time (Seconds)
HRS test condition
Solder method :Reflow, IR/hot air
(Nihon Den-netsu Co., Ltd.’s Part Number:
SENSBY NR-2)
Environment
:Room air
Solder composition :Paste, 96.5%Sn/3.0%Ag/0.5%Cu
(Senju Metal Industry, Co., Ltd.’s Part Number:
M705-221CM5-42-10.5)
Test board
:Glass epoxy 70mm∞80mm∞1.6mm thick
Land dimensions:
0.3mm∞0.65mm, 0.3mm∞0.8mm
Metal mask
:0.23∞0.55∞0.1mm thick,
0.23∞0.65∞0.1mm thick
The temperature profiles are based on the above conditions.
In individual applications the actual temperature may vary,
depending on solder paste type, volume/thickness and board
size/thickness. Consult your solder paste and equipment
manufacturer for specific recommendations.
7