FH26-23S-0.3SHW05 Datasheet, PDF (7/12 Pages) Hirose Electric – 0.3mm Contact Pitch, 1mm above the board, Flexible Printed Circuit ZIF Connectors

Part Number
FH26-13S-0.3SHW(**)
FH26-15S-0.3SHW(**)
FH26-17S-0.3SHW(**)
FH26-21S-0.3SHW(**)
FH26-23S-0.3SHW(**)
FH26-25S-0.3SHW(**)
FH26-27S-0.3SHW(**)
FH26-29S-0.3SHW(**)
FH26-31S-0.3SHW(**)
FH26-33S-0.3SHW(**)
FH26-35S-0.3SHW(**)
FH26-37S-0.3SHW(**)
FH26-39S-0.3SHW(**)
FH26-41S-0.3SHW(**)
FH26-45S-0.3SHW(**)
FH26-51S-0.3SHW(**)
FH26-55S-0.3SHW(**)
FH26-57S-0.3SHW(**)
FH26-61S-0.3SHW(**)
FH26-71S-0.3SHW(**)
Part Number
FH26W-13S-0.3SHW(**)
FH26W-15S-0.3SHW(**)
FH26W-17S-0.3SHW(**)
FH26W-19S-0.3SHW(**)
FH26W-21S-0.3SHW(**)
FH26W-23S-0.3SHW(**)
FH26W-25S-0.3SHW(**)
FH26W-27S-0.3SHW(**)
FH26W-29S-0.3SHW(**)
FH26W-31S-0.3SHW(**)
FH26W-33S-0.3SHW(**)
FH26W-35S-0.3SHW(**)
FH26W-37S-0.3SHW(**)
FH26W-39S-0.3SHW(**)
FH26W-41S-0.3SHW(**)
FH26W-45S-0.3SHW(**)
FH26W-51S-0.3SHW(**)
FH26W-57S-0.3SHW(**)
FH26W-61S-0.3SHW(**)
FH26W-71S-0.3SHW(**)
FH26 SeriesG0.3mm Contact Pitch, 1mm above the board, Flexible Printed Circuit ZIF Connectors
CL No.
Number of Contacts
G
580-0209-3-**
13
16
580-0218-4-**
15
16
580-0217-1-**
17
16
580-0207-8-**
21
16
580-0203-7-**
23
16
580-0208-0-**
25
16
580-0204-0-**
27
16
580-0216-9-**
29
24
580-0214-3-**
31
24
580-0210-2-**
33
24
580-0205-2-**
35
24
580-0224-7-**
37
24
580-0201-1-**
39
24
580-0206-5-**
41
24
580-0211-5-**
45
24
580-0200-9-**
51
24
580-0221-9-**
55
32
580-0212-8-**
57
32
580-0213-0-**
61
32
580-0202-4-**
71
44
CL No.
Number of Contacts
G
580-2401-1-**
13
16
580-2402-4-**
15
16
580-2403-7-**
17
16
580-2437-9-**
19
16
580-2404-0-**
21
16
580-2405-2-**
23
16
580-2406-5-**
25
16
580-2400-9-**
27
16
580-2407-8-**
29
24
580-2408-0-**
31
24
580-2409-3-**
33
24
580-2410-2-**
35
24
580-2411-5-**
37
24
580-2412-8-**
39
24
580-2413-0-**
41
24
580-2414-3-**
45
24
580-2415-6-**
51
24
580-2417-1-**
57
32
580-2418-4-**
61
32
580-2419-7-**
71
44
All dimensions: mm
H
J
K
L
M
----
7.5
5.6
17.4
21.4
----
7.5
6.2
17.4
21.4
----
7.5
6.8
17.4
21.4
----
7.5
8.0
17.4
21.4
----
7.5
8.6
17.4
21.4
----
7.5
9.2
17.4
21.4
----
7.5
9.8
17.4
21.4
----
11.5
10.4
25.4
29.4
----
11.5
11.0
25.4
29.4
----
11.5
11.6
25.4
29.4
----
11.5
12.2
25.4
29.4
----
11.5
12.8
25.4
29.4
----
11.5
13.4
25.4
29.4
----
11.5
14.0
25.4
29.4
----
11.5
15.2
25.4
29.4
----
11.5
17.0
25.4
29.4
28.4
14.2
18.2
33.4
37.4
28.4
14.2
18.8
33.4
37.4
28.4
14.2
20.0
33.4
37.4
40.4
20.2
23.0
45.4
49.4
H
J
K
L
M
----
7.5
5.6
17.4
21.4
----
7.5
6.2
17.4
21.4
----
7.5
6.8
17.4
21.4
----
7.5
7.4
17.4
21.4
----
7.5
8.0
17.4
21.4
----
7.5
8.6
17.4
21.4
----
7.5
9.2
17.4
21.4
----
7.5
9.8
17.4
21.4
----
11.5
10.4
25.4
29.4
----
11.5
11.0
25.4
29.4
----
11.5
11.6
25.4
29.4
----
11.5
12.2
25.4
29.4
----
11.5
12.8
25.4
29.4
----
11.5
13.4
25.4
29.4
----
11.5
14.0
25.4
29.4
----
11.5
15.2
25.4
29.4
----
11.5
17.0
25.4
29.4
28.4
14.2
18.8
33.4
37.4
28.4
14.2
20.0
33.4
37.4
40.4
20.2
23.0
45.4
49.4
IRecommended Temperature Profile
MAX 250ç
250
230ç
200
200ç
150
(ç)
100
150ç
50
25ç _{(60sec.) 90 sec. to 120 sec.}
(60sec.)
0
Start
Preheating
Soldering
60
120
Time (Seconds)
HRS test conditions
Solder method
:Reflow, IR/hot air
Environment
:Room air
Solder composition :Paste, 96.5%Sn/3.0%Ag/0.5%Cu
(Senju Metal Industry, Co., Ltd.'s
Part Number: M705-221CM5-32-10.5)
Test board
:Glass epoxy 25mm∞50mm∞0.8mm thick
Land dimensions :0.3mm∞0.65mm, 0.3mm∞0.8mm
Metal mask
:0.23∞0.55∞0.1mm thick,
0.23∞0.65∞0.1mm thick
The temperature profiles are based on the above conditions.
In individual applications the actual temperature may vary,
depending on solder paste type, volume/thickness and board
size/thickness. Consult your solder paste and equipment
manufacturer for specific recommendations.
7