FH26-23S-0.3SHW05 Datasheet, PDF (5/12 Pages) Hirose Electric – 0.3mm Contact Pitch, 1mm above the board, Flexible Printed Circuit ZIF Connectors

FH26 SeriesG0.3mm Contact Pitch, 1mm above the board, Flexible Printed Circuit ZIF Connectors
IRecommended FPC Construction
GContact FPC manufacturer for specific details.
1. Using Single-sided FPC
Connecting side
Material Name
Material
Thickness (µm)
Covering film layer.
Polyimide 1 mil thick.
25
Cover adhesive
25
1µm to 5µm Nickel underplated
Surface treatment
0.2µm Gold plated
3
Copper foil
Cu
1/2oz
35
Base adhesive
Thermosetting adhesive
25
Base film
Polyimide 1 mil thick
25
Reinforcement material adhesive Thermosetting adhesive
40
Stiffener
Polyimide 3 mil thick
75
Total
203
Back side
2. Using Double-sided FPC
Connecting side
Back side
Material Name
Material
Thickness (µm)
Covering layer film
Polyimide 1 mil thick
25
Cover adhesive
25
1µm to 5µm Nickel underplated
Surface treatment
0.2µm Gold plated
3
Through-hole copper
Cu
15
Copper foil
Cu
1/2oz
18
Base adhesive
Thermosetting adhesive
18
Base film
Polyimide 1 mil thick
25
Base adhesive
Thermosetting adhesive
18
Copper foil
Cu
1/2oz
18
Cover adhesive
Thermosetting adhesive
25
Covering layer film
Polyimide 1 mil thick
25
Reinforcement material adhesive Thermosetting adhesive
25
Stiffener
Polyimide 1 mil thick
25
Total
197
GTo prevent release of the FPC due to it's bending, use of double sided FPC with copper foil on the back side is NOT RECOMMENDED.
3. Precautions
1. This specification is a recommendation for the construction of the FH26 Series FPC and FFC (t=0.2 ± 0.03).
2. For details about the construction, please contact the FPC/FFC manufacturers.
5