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| DG201CJ Datasheet, PDF (7/8 Pages) Harris Corporation – CMOS Dual/Quad SPST Analog Switches | |||
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Metallization Topology
DIE DIMENSIONS:
74 x 77 x 14 ± 1mils
METALLIZATION:
Type: Al
Thickness: 10kÃ
± 1kÃ
GLASSIVATION:
Type: SiO2/Si3N4
SiO2 Thickness: 7kÃ
± 1.4kÃ
Si3N4 Thickness: 8kÃ
± 1.2kÃ
WORST CASE CURRENT DENSITY:
1 x 105 A/cm2
Metallization Mask Layout
D1
(9)
DG200
DG200
V-
D2
(7)
(6)
S1 (10)
V- (SUBSTRATE)* (12)
(5) S2
(14)
(1)
IN1
IN2
* Backside of Chip is V+
(3)
GND
9-19
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