S7986-01 Datasheet, PDF (6/7 Pages) Hamamatsu Corporation – CCD area image sensor Back-thinned FT-CCD for low-light-level NTSC B/W TV application

CCD area image sensor S7986-01, S7987-01
s Specifications of built-in TE-cooler (S7987-01)
Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
Internal resistance
Maximum current *¹¹
Rint
Ta=27 °C
-
1.2
-
Ω
Th *¹²=27 °C
Imax
∆T *¹³=∆Tmax
-
-
3.0
A
Th *¹²=27 °C
Maximum voltage
Vmax
∆T = ∆Tmax
-
-
3.6
V
Maximum heat absorption *¹⁴
I = Imax
Tc *¹⁵=Th *¹²=27 °C
Qmax
-
I = Imax
-
5.0
W
Maximum temperature at hot side
-
-
-
-
70
°C
CCD temperature
-
Ta=25 °C
-10
0
°C
*11: If the current is greater than Imax, the heat absorption begins to decrease due to the Joule heat. It should be noted that
this value is not a damage threshold. To protect the thermoelectric cooler and maintain stable operation, the supply
current should be less than 60 % of this maximum current.
*12: Temperature at hot side of thermoelectric cooler.
*13: ∆T = Th - Tc
*14: This is a theoretical heat absorption level that offsets the temperature difference in the TE-cooler element when the
maximum current is supplied to the unit.
*15: Temperature at cool side of thermoelectric cooler.
(Typ. Ta=25 ˚C)
7
30
VOLTAGE vs. CURRENT
CCD TEMPERATURE vs. CURRENT
6
20
5
10
4
0
3
-10
2
-20
1
-30
0
-40
0
1
2
3
4
CURRENT (A)
KMPDB0179EA
s Specifications of built-in temperature sensor (S7987-01)
1 MΩ
A chip thermistor is built in the same package with a CCD chip, and the
CCD chip temperature can be monitored with it. A relation between the
thermistor resistance and absolute temperature is expressed by the
following equation.
(Typ. Ta=25 ˚C)
R1 = R2 × expB (1 / T1 – 1 / T2)
where R1 is the resistance at absolute temperature T1 (K)
R2 is the resistance at absolute temperature T2 (K)
B is so-called the B constant (K)
100 kΩ
The characteristics of the thermistor used are as follows.
R (298 K)=10 kΩ
B (298 K / 323 K)=3450 K.
10 kΩ
220
240
260
280
TEMPERATURE (K)
300
KMPDB0111EA
6